JPS5514785U - - Google Patents

Info

Publication number
JPS5514785U
JPS5514785U JP1978098607U JP9860778U JPS5514785U JP S5514785 U JPS5514785 U JP S5514785U JP 1978098607 U JP1978098607 U JP 1978098607U JP 9860778 U JP9860778 U JP 9860778U JP S5514785 U JPS5514785 U JP S5514785U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1978098607U
Other versions
JPS584189Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978098607U priority Critical patent/JPS584189Y2/ja
Publication of JPS5514785U publication Critical patent/JPS5514785U/ja
Application granted granted Critical
Publication of JPS584189Y2 publication Critical patent/JPS584189Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1978098607U 1978-07-18 1978-07-18 Ic封止構造 Expired JPS584189Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978098607U JPS584189Y2 (ja) 1978-07-18 1978-07-18 Ic封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978098607U JPS584189Y2 (ja) 1978-07-18 1978-07-18 Ic封止構造

Publications (2)

Publication Number Publication Date
JPS5514785U true JPS5514785U (ja) 1980-01-30
JPS584189Y2 JPS584189Y2 (ja) 1983-01-24

Family

ID=29034530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978098607U Expired JPS584189Y2 (ja) 1978-07-18 1978-07-18 Ic封止構造

Country Status (1)

Country Link
JP (1) JPS584189Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287127A (ja) * 1985-06-13 1986-12-17 Matsushita Electric Works Ltd 電子素子用チツプキヤリアの製造方法
CN106257652A (zh) * 2015-06-16 2016-12-28 台达电子企业管理(上海)有限公司 封装模块

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5274760U (ja) * 1975-12-01 1977-06-03
JPS532078A (en) * 1976-06-28 1978-01-10 Citizen Watch Co Ltd Sealing structure for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5274760U (ja) * 1975-12-01 1977-06-03
JPS532078A (en) * 1976-06-28 1978-01-10 Citizen Watch Co Ltd Sealing structure for semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287127A (ja) * 1985-06-13 1986-12-17 Matsushita Electric Works Ltd 電子素子用チツプキヤリアの製造方法
CN106257652A (zh) * 2015-06-16 2016-12-28 台达电子企业管理(上海)有限公司 封装模块
US10123428B2 (en) 2015-06-16 2018-11-06 Delta Electronics (Shanghai) Co., Ltd. Package module
US10314178B2 (en) 2015-06-16 2019-06-04 Delta Electronics (Shanghai) Co., Ltd. Package module

Also Published As

Publication number Publication date
JPS584189Y2 (ja) 1983-01-24

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