JPS55147490A - Production of transducer for mechanical filter - Google Patents
Production of transducer for mechanical filterInfo
- Publication number
- JPS55147490A JPS55147490A JP5618179A JP5618179A JPS55147490A JP S55147490 A JPS55147490 A JP S55147490A JP 5618179 A JP5618179 A JP 5618179A JP 5618179 A JP5618179 A JP 5618179A JP S55147490 A JPS55147490 A JP S55147490A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- transducer
- faying
- parts
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
PURPOSE: To obtain the transducer of less vibration loss and higher temperature stability by sandwiching solder between the faying surfaces of a constant-elastic alloy and piezoelectric ceramics and performing diffusion bonding through thermal pressure-welding then heating the faying parts to force out the solder of said parts.
CONSTITUTION: Solder foils 5 are sandwiched between the metal surfaces 3, 4 of a constant-elastic alloy 1 and piezoelectric ceramics 2 and these are tentatively assembled by using jigs 6. The assembly is so installed on a support table 10 as to position within a high-frequency coil 9 and is pressed by a pressing bar 11. If the temperature is maintained for a fixed time at the melting point or less of the solder 5, diffusion occurs between the solder foils 5 and metal, whereby initial bonding is effected. Thence, the assembly is heated to the melting point or more of the solder 5, then the undiffused layer of the faying parts 18 melt the solder 5 and pushes the same out into an escaping hole 8. When the bonded transducer is removed from the jigs 6 after the bonding, the extruded solder 19 is ironed away by the corner part 15 of the escape hole 8. This method yields the transducer with good workability.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5618179A JPS55147490A (en) | 1979-05-08 | 1979-05-08 | Production of transducer for mechanical filter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5618179A JPS55147490A (en) | 1979-05-08 | 1979-05-08 | Production of transducer for mechanical filter |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55147490A true JPS55147490A (en) | 1980-11-17 |
Family
ID=13019928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5618179A Pending JPS55147490A (en) | 1979-05-08 | 1979-05-08 | Production of transducer for mechanical filter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55147490A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57139485A (en) * | 1981-02-25 | 1982-08-28 | Hitachi Cable Ltd | Connecting method of metallic material |
US5121871A (en) * | 1990-04-20 | 1992-06-16 | The United States Of America As Represented By The United States Department Of Energy | Solder extrusion pressure bonding process and bonded products produced thereby |
EP0908262A2 (en) * | 1997-10-13 | 1999-04-14 | Daido Steel Company Limited | Mounting method of bonding insert material and jig used in the method |
KR100437188B1 (en) * | 2002-07-15 | 2004-06-23 | 전자부품연구원 | Method of packaging optical device for optical communication |
KR100444111B1 (en) * | 2002-12-05 | 2004-08-11 | 전자부품연구원 | Method of epoxy curing and soldering for optical components packaging |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5317543A (en) * | 1976-07-30 | 1978-02-17 | Steigerwald Strahltech | Method of controlling procedure parameters in energyy beam welding and apparatus therefor |
-
1979
- 1979-05-08 JP JP5618179A patent/JPS55147490A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5317543A (en) * | 1976-07-30 | 1978-02-17 | Steigerwald Strahltech | Method of controlling procedure parameters in energyy beam welding and apparatus therefor |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57139485A (en) * | 1981-02-25 | 1982-08-28 | Hitachi Cable Ltd | Connecting method of metallic material |
US5121871A (en) * | 1990-04-20 | 1992-06-16 | The United States Of America As Represented By The United States Department Of Energy | Solder extrusion pressure bonding process and bonded products produced thereby |
EP0908262A2 (en) * | 1997-10-13 | 1999-04-14 | Daido Steel Company Limited | Mounting method of bonding insert material and jig used in the method |
EP0908262A3 (en) * | 1997-10-13 | 2002-03-20 | Daido Steel Company Limited | Mounting method of bonding insert material and jig used in the method |
KR100437188B1 (en) * | 2002-07-15 | 2004-06-23 | 전자부품연구원 | Method of packaging optical device for optical communication |
KR100444111B1 (en) * | 2002-12-05 | 2004-08-11 | 전자부품연구원 | Method of epoxy curing and soldering for optical components packaging |
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