JPS55147490A - Production of transducer for mechanical filter - Google Patents

Production of transducer for mechanical filter

Info

Publication number
JPS55147490A
JPS55147490A JP5618179A JP5618179A JPS55147490A JP S55147490 A JPS55147490 A JP S55147490A JP 5618179 A JP5618179 A JP 5618179A JP 5618179 A JP5618179 A JP 5618179A JP S55147490 A JPS55147490 A JP S55147490A
Authority
JP
Japan
Prior art keywords
solder
transducer
faying
parts
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5618179A
Other languages
Japanese (ja)
Inventor
Toyokazu Inaba
Yasumichi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP5618179A priority Critical patent/JPS55147490A/en
Publication of JPS55147490A publication Critical patent/JPS55147490A/en
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE: To obtain the transducer of less vibration loss and higher temperature stability by sandwiching solder between the faying surfaces of a constant-elastic alloy and piezoelectric ceramics and performing diffusion bonding through thermal pressure-welding then heating the faying parts to force out the solder of said parts.
CONSTITUTION: Solder foils 5 are sandwiched between the metal surfaces 3, 4 of a constant-elastic alloy 1 and piezoelectric ceramics 2 and these are tentatively assembled by using jigs 6. The assembly is so installed on a support table 10 as to position within a high-frequency coil 9 and is pressed by a pressing bar 11. If the temperature is maintained for a fixed time at the melting point or less of the solder 5, diffusion occurs between the solder foils 5 and metal, whereby initial bonding is effected. Thence, the assembly is heated to the melting point or more of the solder 5, then the undiffused layer of the faying parts 18 melt the solder 5 and pushes the same out into an escaping hole 8. When the bonded transducer is removed from the jigs 6 after the bonding, the extruded solder 19 is ironed away by the corner part 15 of the escape hole 8. This method yields the transducer with good workability.
COPYRIGHT: (C)1980,JPO&Japio
JP5618179A 1979-05-08 1979-05-08 Production of transducer for mechanical filter Pending JPS55147490A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5618179A JPS55147490A (en) 1979-05-08 1979-05-08 Production of transducer for mechanical filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5618179A JPS55147490A (en) 1979-05-08 1979-05-08 Production of transducer for mechanical filter

Publications (1)

Publication Number Publication Date
JPS55147490A true JPS55147490A (en) 1980-11-17

Family

ID=13019928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5618179A Pending JPS55147490A (en) 1979-05-08 1979-05-08 Production of transducer for mechanical filter

Country Status (1)

Country Link
JP (1) JPS55147490A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139485A (en) * 1981-02-25 1982-08-28 Hitachi Cable Ltd Connecting method of metallic material
US5121871A (en) * 1990-04-20 1992-06-16 The United States Of America As Represented By The United States Department Of Energy Solder extrusion pressure bonding process and bonded products produced thereby
EP0908262A2 (en) * 1997-10-13 1999-04-14 Daido Steel Company Limited Mounting method of bonding insert material and jig used in the method
KR100437188B1 (en) * 2002-07-15 2004-06-23 전자부품연구원 Method of packaging optical device for optical communication
KR100444111B1 (en) * 2002-12-05 2004-08-11 전자부품연구원 Method of epoxy curing and soldering for optical components packaging

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317543A (en) * 1976-07-30 1978-02-17 Steigerwald Strahltech Method of controlling procedure parameters in energyy beam welding and apparatus therefor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317543A (en) * 1976-07-30 1978-02-17 Steigerwald Strahltech Method of controlling procedure parameters in energyy beam welding and apparatus therefor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139485A (en) * 1981-02-25 1982-08-28 Hitachi Cable Ltd Connecting method of metallic material
US5121871A (en) * 1990-04-20 1992-06-16 The United States Of America As Represented By The United States Department Of Energy Solder extrusion pressure bonding process and bonded products produced thereby
EP0908262A2 (en) * 1997-10-13 1999-04-14 Daido Steel Company Limited Mounting method of bonding insert material and jig used in the method
EP0908262A3 (en) * 1997-10-13 2002-03-20 Daido Steel Company Limited Mounting method of bonding insert material and jig used in the method
KR100437188B1 (en) * 2002-07-15 2004-06-23 전자부품연구원 Method of packaging optical device for optical communication
KR100444111B1 (en) * 2002-12-05 2004-08-11 전자부품연구원 Method of epoxy curing and soldering for optical components packaging

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