JPS5513948A - Structure of electrode - Google Patents

Structure of electrode

Info

Publication number
JPS5513948A
JPS5513948A JP8725678A JP8725678A JPS5513948A JP S5513948 A JPS5513948 A JP S5513948A JP 8725678 A JP8725678 A JP 8725678A JP 8725678 A JP8725678 A JP 8725678A JP S5513948 A JPS5513948 A JP S5513948A
Authority
JP
Japan
Prior art keywords
groove
electrode
wire
metal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8725678A
Other languages
Japanese (ja)
Inventor
Sumio Imaoka
Susumu Sato
Kunihiko Hirashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Electronic Corp filed Critical Pioneer Electronic Corp
Priority to JP8725678A priority Critical patent/JPS5513948A/en
Publication of JPS5513948A publication Critical patent/JPS5513948A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent dislocation thus reducing an electrode area by providing a groove in a substrate to where a fine metal wire is to be connected when it is connected with the semiconductor substrate, and then connecting by soldering the groove.
CONSTITUTION: A groove 7 is formed at a required position in a semiconductor substrate 1 by means of plasma etching; then the entire surface of the substrate including the groove is covered by a SiO2 film 2 on which a metal 3' such as Al or Mo is covered by means of spattering. The metal 3' is etched by utilizing a mask for an electrode wiring, to form a wiring pattern such as a group of circuits and groove periphery as well as inside of the groove 7 that is used as an electrode element 3. Then a wire 5 made of Au, Al, and the like, is inserted in the groove to which a solder 8 is filled to secure the connection. By so doing, the area of the electrode can be reduced without using a specially fine wire.
COPYRIGHT: (C)1980,JPO&Japio
JP8725678A 1978-07-18 1978-07-18 Structure of electrode Pending JPS5513948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8725678A JPS5513948A (en) 1978-07-18 1978-07-18 Structure of electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8725678A JPS5513948A (en) 1978-07-18 1978-07-18 Structure of electrode

Publications (1)

Publication Number Publication Date
JPS5513948A true JPS5513948A (en) 1980-01-31

Family

ID=13909694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8725678A Pending JPS5513948A (en) 1978-07-18 1978-07-18 Structure of electrode

Country Status (1)

Country Link
JP (1) JPS5513948A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108686A (en) * 2009-11-12 2011-06-02 Ricoh Co Ltd Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129280A (en) * 1976-04-22 1977-10-29 Fujitsu Ltd Wire bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129280A (en) * 1976-04-22 1977-10-29 Fujitsu Ltd Wire bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108686A (en) * 2009-11-12 2011-06-02 Ricoh Co Ltd Semiconductor device

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