JPS55127047A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS55127047A
JPS55127047A JP3442879A JP3442879A JPS55127047A JP S55127047 A JPS55127047 A JP S55127047A JP 3442879 A JP3442879 A JP 3442879A JP 3442879 A JP3442879 A JP 3442879A JP S55127047 A JPS55127047 A JP S55127047A
Authority
JP
Japan
Prior art keywords
tab
resin
pellet
lead
concavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3442879A
Other languages
Japanese (ja)
Inventor
Hajime Murakami
Minoru Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3442879A priority Critical patent/JPS55127047A/en
Publication of JPS55127047A publication Critical patent/JPS55127047A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PURPOSE:To minimize further the thickness of a device by making the portion of a tab whereat a semiconductor pellet is loaded and fixed thinner than a lead. CONSTITUTION:A resin-sealed semiconductor device comprises a tab 11 with a concavity 11a formed at the center, a plural lead 12, a semiconductor pellet 13 fixed in the concavity 11a, a bonding wire 14, and a resin-sealed member 15 covering the tab 11, tab side of the lead 12, the pellet 13 and the wire 14 collectively. According to this constitution, the portion of the tab 11 whereat the pellet 13 is loaded and fixed comes in the concavity 11a, and thus the overall device can be made thin by a dimension d keeping the tab so thin without changing sizes the pellet 13, the lead 12 and the resin-sealed member 15.
JP3442879A 1979-03-26 1979-03-26 Resin-sealed semiconductor device Pending JPS55127047A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3442879A JPS55127047A (en) 1979-03-26 1979-03-26 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3442879A JPS55127047A (en) 1979-03-26 1979-03-26 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS55127047A true JPS55127047A (en) 1980-10-01

Family

ID=12413933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3442879A Pending JPS55127047A (en) 1979-03-26 1979-03-26 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS55127047A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60129154U (en) * 1984-02-07 1985-08-30 日本電気株式会社 Lead frame for semiconductor devices
JPS62140755U (en) * 1986-02-28 1987-09-05
JPS62163962U (en) * 1986-04-08 1987-10-17
JPH01255260A (en) * 1988-04-04 1989-10-12 Nec Corp Structure of lead frame
JP2002184911A (en) * 2000-12-15 2002-06-28 Nippon Inter Electronics Corp Resin sealed electronic component
JP2002353403A (en) * 2001-03-05 2002-12-06 Samsung Electronics Co Ltd Ultra-thin semiconductor package and manufacturing method therefor
WO2003077315A3 (en) * 2002-03-06 2004-01-08 Motorola Inc Multi-row leadframe
JP2015185619A (en) * 2014-03-20 2015-10-22 日立マクセル株式会社 Substrate for semiconductor device, manufacturing method of substrate, semiconductor device and semiconductor device manufacturing method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60129154U (en) * 1984-02-07 1985-08-30 日本電気株式会社 Lead frame for semiconductor devices
JPS62140755U (en) * 1986-02-28 1987-09-05
JPS62163962U (en) * 1986-04-08 1987-10-17
JPH01255260A (en) * 1988-04-04 1989-10-12 Nec Corp Structure of lead frame
JP2002184911A (en) * 2000-12-15 2002-06-28 Nippon Inter Electronics Corp Resin sealed electronic component
JP2002353403A (en) * 2001-03-05 2002-12-06 Samsung Electronics Co Ltd Ultra-thin semiconductor package and manufacturing method therefor
JP4549608B2 (en) * 2001-03-05 2010-09-22 三星電子株式会社 Ultra-thin semiconductor package and manufacturing method thereof
WO2003077315A3 (en) * 2002-03-06 2004-01-08 Motorola Inc Multi-row leadframe
US6838751B2 (en) 2002-03-06 2005-01-04 Freescale Semiconductor Inc. Multi-row leadframe
JP2015185619A (en) * 2014-03-20 2015-10-22 日立マクセル株式会社 Substrate for semiconductor device, manufacturing method of substrate, semiconductor device and semiconductor device manufacturing method

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