JPS55120080A - Led display unit - Google Patents

Led display unit

Info

Publication number
JPS55120080A
JPS55120080A JP2714479A JP2714479A JPS55120080A JP S55120080 A JPS55120080 A JP S55120080A JP 2714479 A JP2714479 A JP 2714479A JP 2714479 A JP2714479 A JP 2714479A JP S55120080 A JPS55120080 A JP S55120080A
Authority
JP
Japan
Prior art keywords
display unit
led display
led
unit
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2714479A
Other languages
Japanese (ja)
Inventor
Yuusaku Nishi
Tamio Saitou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP2714479A priority Critical patent/JPS55120080A/en
Publication of JPS55120080A publication Critical patent/JPS55120080A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP2714479A 1979-03-08 1979-03-08 Led display unit Pending JPS55120080A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2714479A JPS55120080A (en) 1979-03-08 1979-03-08 Led display unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2714479A JPS55120080A (en) 1979-03-08 1979-03-08 Led display unit

Publications (1)

Publication Number Publication Date
JPS55120080A true JPS55120080A (en) 1980-09-16

Family

ID=12212852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2714479A Pending JPS55120080A (en) 1979-03-08 1979-03-08 Led display unit

Country Status (1)

Country Link
JP (1) JPS55120080A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007305355A (en) * 2006-05-10 2007-11-22 Mitsubishi Cable Ind Ltd Terminal, and aluminum electric wire therewith, and its manufacturing method
JP2008293693A (en) * 2007-05-22 2008-12-04 Sumitomo Wiring Syst Ltd Terminal fitting
JP2009117085A (en) * 2007-11-02 2009-05-28 Autonetworks Technologies Ltd Crimping terminal, electric wire with terminal, and manufacturing method of same
JP2009123622A (en) * 2007-11-16 2009-06-04 Yazaki Corp Crimping terminal for aluminum wire
US9136628B2 (en) 2011-12-12 2015-09-15 Autonetworks Technologies, Ltd. Crimp type terminal fitting

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007305355A (en) * 2006-05-10 2007-11-22 Mitsubishi Cable Ind Ltd Terminal, and aluminum electric wire therewith, and its manufacturing method
JP2008293693A (en) * 2007-05-22 2008-12-04 Sumitomo Wiring Syst Ltd Terminal fitting
JP2009117085A (en) * 2007-11-02 2009-05-28 Autonetworks Technologies Ltd Crimping terminal, electric wire with terminal, and manufacturing method of same
US8070536B2 (en) 2007-11-02 2011-12-06 Autonetworks Technologies, Ltd. Crimp terminal, terminal-provided wire, and manufacturing method thereof
JP2009123622A (en) * 2007-11-16 2009-06-04 Yazaki Corp Crimping terminal for aluminum wire
US9136628B2 (en) 2011-12-12 2015-09-15 Autonetworks Technologies, Ltd. Crimp type terminal fitting

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