JPS5498186A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS5498186A
JPS5498186A JP493478A JP493478A JPS5498186A JP S5498186 A JPS5498186 A JP S5498186A JP 493478 A JP493478 A JP 493478A JP 493478 A JP493478 A JP 493478A JP S5498186 A JPS5498186 A JP S5498186A
Authority
JP
Japan
Prior art keywords
gate
amount
reducing
layer
metalic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP493478A
Other languages
Japanese (ja)
Inventor
Tadatoshi Nozaki
Hidekazu Okabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP493478A priority Critical patent/JPS5498186A/en
Publication of JPS5498186A publication Critical patent/JPS5498186A/en
Pending legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To improve the operating speed of semiconductor system by adjusting the amount of side-etching almost equal to the amount to the amount of lateral spreading of source drain connection and reducing the overlapping of joint between gate electrode and source drain, thus reducing the floating capacity between gate substrates.
CONSTITUTION: Allow gate insulation film 2 to grow on the surface of semiconductor substrate 1, form metalic layer 3 used as gate metalic layer on substrate 1 and, then, form mask 8 on the metalic layer which is used for forming metalic layer 3 as the gate metalic layer. Then, ion-inject the conductive form impurity located opposite to substrate 1 through insulation film 2 and side-etch the gate metal layer by using mask 8 as the side-etch mask, thus ultimately forming the shape of gate electrode while at the same time adjusting the amount of side etch almost equal to laterally spread amount of source drain connectinn and reducing the overlapping at the joint gate electrode and source chain, thus reducing the floating capacity between substrates 1 extensively increasing the operating speed of semiconductor device.
COPYRIGHT: (C)1979,JPO&Japio
JP493478A 1978-01-19 1978-01-19 Preparation of semiconductor device Pending JPS5498186A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP493478A JPS5498186A (en) 1978-01-19 1978-01-19 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP493478A JPS5498186A (en) 1978-01-19 1978-01-19 Preparation of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5498186A true JPS5498186A (en) 1979-08-02

Family

ID=11597399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP493478A Pending JPS5498186A (en) 1978-01-19 1978-01-19 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5498186A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115568A (en) * 1980-02-19 1981-09-10 Toshiba Corp Manufacture of semiconductor device
JPS5743466A (en) * 1980-08-28 1982-03-11 Toshiba Corp Insulated gate type field effect transistor and manufacture thereof
KR100781453B1 (en) 2006-08-23 2007-12-03 동부일렉트로닉스 주식회사 Device and method for manufacturing mos transistor's gate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115568A (en) * 1980-02-19 1981-09-10 Toshiba Corp Manufacture of semiconductor device
JPS5743466A (en) * 1980-08-28 1982-03-11 Toshiba Corp Insulated gate type field effect transistor and manufacture thereof
KR100781453B1 (en) 2006-08-23 2007-12-03 동부일렉트로닉스 주식회사 Device and method for manufacturing mos transistor's gate

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