JPS5490025A - Plating tool - Google Patents

Abstract

PURPOSE: To make economical and efficient plating operation by the procedure in which a thin plate, e.g., the lead frame, etc. of electronic parts, is inserted into a part of a H-shaped section and then the parts arranged with many spacers are soaked in a plating tank for electric plating.

CONSTITUTION: The thin plate 31, e.g., the lead frame, etc. to be plated is inserted into the groove 26 of the part 11 of a H-shaped section. Then, the H-shaped parts 11 are arranged in a plural bamboo blind form and then piled up by inserting the upper spacer 12 and the lower spacer 14 between them. In this case, the anode mesh 13 is welded onto the upper spacer 12 and also the hole 29 is bored in the lower spacer 14, through which cathode lead wire is passed. The piled H-shaped parts 11 are securely held between a pair of the upper guide plate 15 and the lower guide plate 16, and then clamped with the clamping bar 21 and the nut 22, putting between the upper spacer 12 and the lower spacer 14, after inserting the cathode lead wire 24 into the hole. The thin plate 31 inserted into the groove 26 is connected to cathode through the cathode lead wire 24, and then subjected to plating operation simply without the use of L-shaped coupling pin, etc..

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