JPS548871A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS548871A
JPS548871A JP7472977A JP7472977A JPS548871A JP S548871 A JPS548871 A JP S548871A JP 7472977 A JP7472977 A JP 7472977A JP 7472977 A JP7472977 A JP 7472977A JP S548871 A JPS548871 A JP S548871A
Authority
JP
Japan
Prior art keywords
circuit
printed
configuration
conductors
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7472977A
Other languages
Japanese (ja)
Inventor
Kazuo Kawasumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suwa Seikosha KK
Original Assignee
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha KK filed Critical Suwa Seikosha KK
Priority to JP7472977A priority Critical patent/JPS548871A/en
Priority to CH688678A priority patent/CH638947GA3/en
Publication of JPS548871A publication Critical patent/JPS548871A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Electromechanical Clocks (AREA)

Abstract

A circuit for an electronic timepiece, especially for an electronic wristwatch, comprises a plate or printed-circuit sheet (1) carrying a configuration of conductors (1a) whose various points receive electrical connections of an integrated circuit (3). An aperture (1b) is made in the plate or printed-circuit sheet, and a metal plate (11) is affixed, by adhesion, to the back of the printed circuit (1). The integrated circuit board (3) is arranged in this aperture and it is connected by fine, very short conductors (5) to the configuration of conductors (1a). A plastic coating (6) is arranged over the printed circuit board (3) and over the latter's connections with the configuration and to the conductor. This circuit allows very thin construction and easy manufacture of the electronic watch. <IMAGE>
JP7472977A 1977-06-23 1977-06-23 Semiconductor device Pending JPS548871A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP7472977A JPS548871A (en) 1977-06-23 1977-06-23 Semiconductor device
CH688678A CH638947GA3 (en) 1977-06-23 1978-06-23 Circuit for electronic timepiece, especially for an electronic wristwatch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7472977A JPS548871A (en) 1977-06-23 1977-06-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS548871A true JPS548871A (en) 1979-01-23

Family

ID=13555592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7472977A Pending JPS548871A (en) 1977-06-23 1977-06-23 Semiconductor device

Country Status (2)

Country Link
JP (1) JPS548871A (en)
CH (1) CH638947GA3 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608440A (en) * 1983-06-29 1985-01-17 Toyota Motor Corp Control of idling speed control system
JP2009030842A (en) * 2007-07-25 2009-02-12 Sharp Corp Humidifier and filter
JP2010025360A (en) * 2008-07-15 2010-02-04 Daikin Ind Ltd Humidifying device
US8382073B2 (en) 2007-07-18 2013-02-26 Sharp Kabushiki Kaisha Humidifier, filter unit and rotation drive structure
USRE45146E1 (en) 2002-05-30 2014-09-23 Taiyo Yuden Co., Ltd Composite multi-layer substrate and module using the substrate
WO2017169421A1 (en) * 2016-03-29 2017-10-05 ポリマテック・ジャパン株式会社 Flexible circuit board and method for manufacturing flexible circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29714186U1 (en) * 1997-08-08 1998-12-10 Junghans Gmbh Geb Radio clockwork

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608440A (en) * 1983-06-29 1985-01-17 Toyota Motor Corp Control of idling speed control system
USRE45146E1 (en) 2002-05-30 2014-09-23 Taiyo Yuden Co., Ltd Composite multi-layer substrate and module using the substrate
US8382073B2 (en) 2007-07-18 2013-02-26 Sharp Kabushiki Kaisha Humidifier, filter unit and rotation drive structure
JP2009030842A (en) * 2007-07-25 2009-02-12 Sharp Corp Humidifier and filter
JP2010025360A (en) * 2008-07-15 2010-02-04 Daikin Ind Ltd Humidifying device
WO2017169421A1 (en) * 2016-03-29 2017-10-05 ポリマテック・ジャパン株式会社 Flexible circuit board and method for manufacturing flexible circuit board
JPWO2017169421A1 (en) * 2016-03-29 2019-02-14 積水ポリマテック株式会社 Flexible circuit board and method for manufacturing flexible circuit board

Also Published As

Publication number Publication date
CH638947GA3 (en) 1983-10-31
CH638947B (en)

Similar Documents

Publication Publication Date Title
JPS534528A (en) Keyboard circuit for electronic instrument
JPS548871A (en) Semiconductor device
JPS5494364A (en) Method of making electronic module for timepiece* and electronic module
JPS52114971A (en) Device for mounting lead electronic parts to printed circuit substrate
JPS53112721A (en) Envelope circuit for electronic musical instrument
JPS52107572A (en) Device for soldering electronic element lead wire to conductor on printed circuit board or sililar article
JPS5292368A (en) Electronic wrist watch substrate mounting structure
JPS645894A (en) Thin-type mounting type semiconductor device
CH615313GA3 (en) Method of manufacturing a constituent of an electronic timepiece, especially of a wristwatch, and electronic timepiece constituent resulting from this method
JPS51146861A (en) A structure of electronic timepieces.
ATE67615T1 (en) ELECTRONIC PENDULUMS.
JPS5643746A (en) Lead-less hybrid integrated circuit parts
JPS5384174A (en) Method of drawing electronic part soldered from printed board and device therefor
JPS5259572A (en) Electronic circuit device
JPS5353382A (en) Clock
JPS5398878A (en) Electronic watch
JPS534530A (en) Keyboard circuit for electronic instrument
JPS5392465A (en) Electronic circuit element board
SU608279A1 (en) Device for mounting electronic components with axial leads on printed circuit board
JPS54136320A (en) Data printing and display device of camera
JPS5558591A (en) Structure for mounting electronic watch circuit
JPS52153478A (en) Electronic watch
GB1519700A (en) Circuit board assembly eg for use in an eletronic timepiece
JPS54140970A (en) Circuit substrate for electronic watch
JPS52114970A (en) Device for mounting lead electronic parts to printed circuit substrate