JPS5487756A - Resin granulation apparatus - Google Patents
Resin granulation apparatusInfo
- Publication number
- JPS5487756A JPS5487756A JP15613377A JP15613377A JPS5487756A JP S5487756 A JPS5487756 A JP S5487756A JP 15613377 A JP15613377 A JP 15613377A JP 15613377 A JP15613377 A JP 15613377A JP S5487756 A JPS5487756 A JP S5487756A
- Authority
- JP
- Japan
- Prior art keywords
- granulation apparatus
- resin granulation
- resin
- granulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003179 granulation Effects 0.000 title 1
- 238000005469 granulation Methods 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/02—Making granules by dividing preformed material
- B29B9/06—Making granules by dividing preformed material in the form of filamentary material, e.g. combined with extrusion
- B29B9/065—Making granules by dividing preformed material in the form of filamentary material, e.g. combined with extrusion under-water, e.g. underwater pelletizers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/06—Conditioning or physical treatment of the material to be shaped by drying
- B29B13/065—Conditioning or physical treatment of the material to be shaped by drying of powder or pellets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/16—Auxiliary treatment of granules
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B17/00—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement
- F26B17/12—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement with movement performed solely by gravity, i.e. the material moving through a substantially vertical drying enclosure, e.g. shaft
- F26B17/14—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement with movement performed solely by gravity, i.e. the material moving through a substantially vertical drying enclosure, e.g. shaft the materials moving through a counter-current of gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/02—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
- F26B3/06—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour flowing through the materials or objects to be dried
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B2200/00—Drying processes and machines for solid materials characterised by the specific requirements of the drying good
- F26B2200/08—Granular materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microbiology (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Glanulating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52156133A JPS5942603B2 (en) | 1977-12-24 | 1977-12-24 | resin granulation equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52156133A JPS5942603B2 (en) | 1977-12-24 | 1977-12-24 | resin granulation equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5487756A true JPS5487756A (en) | 1979-07-12 |
JPS5942603B2 JPS5942603B2 (en) | 1984-10-16 |
Family
ID=15621034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52156133A Expired JPS5942603B2 (en) | 1977-12-24 | 1977-12-24 | resin granulation equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5942603B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006297701A (en) * | 2005-04-19 | 2006-11-02 | Hitachi Chem Co Ltd | Manufacturing method of epoxy resin composition for sealing semiconductor, epoxy resin composition for sealing semiconductor and electronic component device using it |
-
1977
- 1977-12-24 JP JP52156133A patent/JPS5942603B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006297701A (en) * | 2005-04-19 | 2006-11-02 | Hitachi Chem Co Ltd | Manufacturing method of epoxy resin composition for sealing semiconductor, epoxy resin composition for sealing semiconductor and electronic component device using it |
JP4662133B2 (en) * | 2005-04-19 | 2011-03-30 | 日立化成工業株式会社 | Method for producing epoxy resin composition for semiconductor encapsulation |
Also Published As
Publication number | Publication date |
---|---|
JPS5942603B2 (en) | 1984-10-16 |
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