JPS5485156A - Solder - Google Patents
SolderInfo
- Publication number
- JPS5485156A JPS5485156A JP15402377A JP15402377A JPS5485156A JP S5485156 A JPS5485156 A JP S5485156A JP 15402377 A JP15402377 A JP 15402377A JP 15402377 A JP15402377 A JP 15402377A JP S5485156 A JPS5485156 A JP S5485156A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- shape
- soldering
- joining face
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:Solder, improving the efficiency of soldering operation and realizing a high quality soldering even for complicated shape of joining face, by preliminary forming each powdered solder and flux corresponding to the shape of joining face. CONSTITUTION:Mixed powder of each powdered solder and flux 2 is compressed on the solder 1 and is formed in washer-shape corresponding to the shape of joining face, cylindrical shape or that of having difference in grade by using press etc. The above solder 1 is provided on the material to be soldered 3 by the parts feeder or vacuum pincette etc. and the material to be soldered 4 is provided on the solder 1 in the same way and then, soldering is carried out heating by the electric furnace, high frequency heating, hot plate or hot iron. By using the above solder, highly reliable soldering operation is realized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15402377A JPS5485156A (en) | 1977-12-20 | 1977-12-20 | Solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15402377A JPS5485156A (en) | 1977-12-20 | 1977-12-20 | Solder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5485156A true JPS5485156A (en) | 1979-07-06 |
Family
ID=15575206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15402377A Pending JPS5485156A (en) | 1977-12-20 | 1977-12-20 | Solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5485156A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05177386A (en) * | 1991-12-27 | 1993-07-20 | Showa Alum Corp | Flux-containing al alloy brazing filler metal |
WO1998000252A1 (en) * | 1996-06-28 | 1998-01-08 | Nippon Steel Corporation | Rapidly solidified foil for ring-like welding material, its production process and apparatus, and nozzle for producing the same |
CN105598603A (en) * | 2016-03-18 | 2016-05-25 | 江门市上庆自动化设备有限公司 | Method for adding scaling powder into solder |
CN106001980A (en) * | 2016-06-15 | 2016-10-12 | 中国科学院电工研究所 | High-temperature lead-free soldering lug for encapsulating power electronic module and preparation method thereof |
-
1977
- 1977-12-20 JP JP15402377A patent/JPS5485156A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05177386A (en) * | 1991-12-27 | 1993-07-20 | Showa Alum Corp | Flux-containing al alloy brazing filler metal |
WO1998000252A1 (en) * | 1996-06-28 | 1998-01-08 | Nippon Steel Corporation | Rapidly solidified foil for ring-like welding material, its production process and apparatus, and nozzle for producing the same |
CN105598603A (en) * | 2016-03-18 | 2016-05-25 | 江门市上庆自动化设备有限公司 | Method for adding scaling powder into solder |
CN106001980A (en) * | 2016-06-15 | 2016-10-12 | 中国科学院电工研究所 | High-temperature lead-free soldering lug for encapsulating power electronic module and preparation method thereof |
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