JPS5484686A - Dressing method of metal bond grind stone - Google Patents

Dressing method of metal bond grind stone

Info

Publication number
JPS5484686A
JPS5484686A JP15214077A JP15214077A JPS5484686A JP S5484686 A JPS5484686 A JP S5484686A JP 15214077 A JP15214077 A JP 15214077A JP 15214077 A JP15214077 A JP 15214077A JP S5484686 A JPS5484686 A JP S5484686A
Authority
JP
Japan
Prior art keywords
metal bond
grinding
metal
dressing
grinding stone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15214077A
Other languages
Japanese (ja)
Inventor
Yasuo Kimoto
Hiroshi Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Zosen Corp
Original Assignee
Hitachi Zosen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Zosen Corp filed Critical Hitachi Zosen Corp
Priority to JP15214077A priority Critical patent/JPS5484686A/en
Publication of JPS5484686A publication Critical patent/JPS5484686A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/001Devices or means for dressing or conditioning abrasive surfaces involving the use of electric current

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

PURPOSE:To effect and improve cutting ability by the application of electric charge and electrolytic operation to a metal bond grinding stone like diamond and boron nitride. CONSTITUTION:Grinding stone which has worn-out front end of a grinding particle 2 in a metal bond layer 1 and has the formation of a covered metal 4, is treated to lower the surface of the metal bond layer 1 to about several mum by suitable electric charge and electrolytic operation and also the covered metal 4 is removed so as to expose a new grinding particle 3. At the same time, the front end of the grinding particle 2 is crushed by small energy charging to form new cutting blade 5 for dressing. By doing so, dressing can be finished in remarkably short time and service life of the grinding stone can be much prolonged.
JP15214077A 1977-12-17 1977-12-17 Dressing method of metal bond grind stone Pending JPS5484686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15214077A JPS5484686A (en) 1977-12-17 1977-12-17 Dressing method of metal bond grind stone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15214077A JPS5484686A (en) 1977-12-17 1977-12-17 Dressing method of metal bond grind stone

Publications (1)

Publication Number Publication Date
JPS5484686A true JPS5484686A (en) 1979-07-05

Family

ID=15533906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15214077A Pending JPS5484686A (en) 1977-12-17 1977-12-17 Dressing method of metal bond grind stone

Country Status (1)

Country Link
JP (1) JPS5484686A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05177524A (en) * 1991-06-18 1993-07-20 Gmn Georg Miller Nurnberg Ag Apparatus and method for rounding edge of semiconductor circular blank

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05177524A (en) * 1991-06-18 1993-07-20 Gmn Georg Miller Nurnberg Ag Apparatus and method for rounding edge of semiconductor circular blank

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