JPS5478660A - Manufacture of vamp-type semiconductor device - Google Patents

Manufacture of vamp-type semiconductor device

Info

Publication number
JPS5478660A
JPS5478660A JP14626477A JP14626477A JPS5478660A JP S5478660 A JPS5478660 A JP S5478660A JP 14626477 A JP14626477 A JP 14626477A JP 14626477 A JP14626477 A JP 14626477A JP S5478660 A JPS5478660 A JP S5478660A
Authority
JP
Japan
Prior art keywords
vamp
chip
mounting
film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14626477A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Koichiro Takahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14626477A priority Critical patent/JPS5478660A/en
Publication of JPS5478660A publication Critical patent/JPS5478660A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To perform mounting of the vamp-type semiconductor device through the tape carrier system with no deteriration of the junction density nor defective operation of the circuit.
CONSTITUTION: SiO2 film 2 is provided on one main surface of Si substrate 1 with vamp terminal 3 attached, and epoxy resin plate 5 and others are attached on the back of the substrate via wax 4 which fuses at about 100°C. The isolating groove is formed to pick up the non-defective products with adsorption tool 7. The wax sticked to the back and the side of the substrate is evaporated and washed away (9) on the washing table 8, and then the chip is put on glass panel 11 containing viscid resin film 10. Lead 12 of the tape carrier is jointed to the vamp terminal of the chip, which are then pulled up to complete the mounting. Film 10 is hardened by the junction heating temperature with deterioration of the viscosity, and an easy pull-up becomes possible for the chip. Thus, a high yield is obtained for the mounting.
COPYRIGHT: (C)1979,JPO&Japio
JP14626477A 1977-12-05 1977-12-05 Manufacture of vamp-type semiconductor device Pending JPS5478660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14626477A JPS5478660A (en) 1977-12-05 1977-12-05 Manufacture of vamp-type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14626477A JPS5478660A (en) 1977-12-05 1977-12-05 Manufacture of vamp-type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5478660A true JPS5478660A (en) 1979-06-22

Family

ID=15403800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14626477A Pending JPS5478660A (en) 1977-12-05 1977-12-05 Manufacture of vamp-type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5478660A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013506311A (en) * 2009-09-28 2013-02-21 ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト−ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー Place station for pick and place machines

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013506311A (en) * 2009-09-28 2013-02-21 ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト−ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー Place station for pick and place machines

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