JPS5478660A - Manufacture of vamp-type semiconductor device - Google Patents
Manufacture of vamp-type semiconductor deviceInfo
- Publication number
- JPS5478660A JPS5478660A JP14626477A JP14626477A JPS5478660A JP S5478660 A JPS5478660 A JP S5478660A JP 14626477 A JP14626477 A JP 14626477A JP 14626477 A JP14626477 A JP 14626477A JP S5478660 A JPS5478660 A JP S5478660A
- Authority
- JP
- Japan
- Prior art keywords
- vamp
- chip
- mounting
- film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To perform mounting of the vamp-type semiconductor device through the tape carrier system with no deteriration of the junction density nor defective operation of the circuit.
CONSTITUTION: SiO2 film 2 is provided on one main surface of Si substrate 1 with vamp terminal 3 attached, and epoxy resin plate 5 and others are attached on the back of the substrate via wax 4 which fuses at about 100°C. The isolating groove is formed to pick up the non-defective products with adsorption tool 7. The wax sticked to the back and the side of the substrate is evaporated and washed away (9) on the washing table 8, and then the chip is put on glass panel 11 containing viscid resin film 10. Lead 12 of the tape carrier is jointed to the vamp terminal of the chip, which are then pulled up to complete the mounting. Film 10 is hardened by the junction heating temperature with deterioration of the viscosity, and an easy pull-up becomes possible for the chip. Thus, a high yield is obtained for the mounting.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14626477A JPS5478660A (en) | 1977-12-05 | 1977-12-05 | Manufacture of vamp-type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14626477A JPS5478660A (en) | 1977-12-05 | 1977-12-05 | Manufacture of vamp-type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5478660A true JPS5478660A (en) | 1979-06-22 |
Family
ID=15403800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14626477A Pending JPS5478660A (en) | 1977-12-05 | 1977-12-05 | Manufacture of vamp-type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5478660A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013506311A (en) * | 2009-09-28 | 2013-02-21 | ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト−ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー | Place station for pick and place machines |
-
1977
- 1977-12-05 JP JP14626477A patent/JPS5478660A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013506311A (en) * | 2009-09-28 | 2013-02-21 | ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト−ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー | Place station for pick and place machines |
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