JPS5471980A - Adhesion method of semiconductor wafer to lapping surface plate - Google Patents
Adhesion method of semiconductor wafer to lapping surface plateInfo
- Publication number
- JPS5471980A JPS5471980A JP13906477A JP13906477A JPS5471980A JP S5471980 A JPS5471980 A JP S5471980A JP 13906477 A JP13906477 A JP 13906477A JP 13906477 A JP13906477 A JP 13906477A JP S5471980 A JPS5471980 A JP S5471980A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- wafer
- sheet
- semiconductor wafer
- lapping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To reduce the number of processes of adhering wafer to surface plate and avoid damage of wiring surface when adhering, by placing a fiber material sheet soaked with thermoplastic adhesive when mounting a semiconductor wafer onto a lapping surface plate, and lapping the wafer after heating and pressing. CONSTITUTION:An adhesion sheet 7 having callulose soaked with thermoplastic adhesive is placed on the adhesion surface of a lapping surface plate 4, and a semiconductor wafer 1 having electrode is mounted thereon with the electrode surface dewnward, being in close contact with the sheet 7. Then pressure is applied by using a heated spindle 8. Then pressure is applied by using a heated spindle 8. Thus, the adhesive contained in the sheet 7 melts out from the wafer 1 side and the surface plate 4 side, so that the wafer 1 is bonded with the surface plate 4 by way of the sheet 7. Removing the spindle 8, the melted adhesive 9 is cooled together with the wafer 1 and the surface plate 4, so that the adhesion of the wafer 1 and the surface plate is reinforced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52139064A JPS5931213B2 (en) | 1977-11-18 | 1977-11-18 | How to bond a semiconductor wafer to a lap surface plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52139064A JPS5931213B2 (en) | 1977-11-18 | 1977-11-18 | How to bond a semiconductor wafer to a lap surface plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5471980A true JPS5471980A (en) | 1979-06-08 |
| JPS5931213B2 JPS5931213B2 (en) | 1984-07-31 |
Family
ID=15236643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52139064A Expired JPS5931213B2 (en) | 1977-11-18 | 1977-11-18 | How to bond a semiconductor wafer to a lap surface plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931213B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6290944A (en) * | 1985-10-17 | 1987-04-25 | Toshiba Ceramics Co Ltd | Silicon wafer bonding device |
| JPS63162155A (en) * | 1982-09-23 | 1988-07-05 | ウィリアム・ディー・ブディンガー | Work mounting method for grinding |
| JP2011522429A (en) * | 2008-06-06 | 2011-07-28 | ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー | Method and corresponding arrangement for fixing a silicon block on a target support |
-
1977
- 1977-11-18 JP JP52139064A patent/JPS5931213B2/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63162155A (en) * | 1982-09-23 | 1988-07-05 | ウィリアム・ディー・ブディンガー | Work mounting method for grinding |
| JPH0426982B2 (en) * | 1982-09-23 | 1992-05-08 | Deii Budeingaa Uiriamu | |
| JPS6290944A (en) * | 1985-10-17 | 1987-04-25 | Toshiba Ceramics Co Ltd | Silicon wafer bonding device |
| JPH0582966B2 (en) * | 1985-10-17 | 1993-11-24 | Toshiba Ceramics Co | |
| JP2011522429A (en) * | 2008-06-06 | 2011-07-28 | ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー | Method and corresponding arrangement for fixing a silicon block on a target support |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5931213B2 (en) | 1984-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3818823A (en) | Heated, vacuum-pressure press | |
| CA2120111A1 (en) | Method of applying adhesive to porous materials | |
| JPS5762539A (en) | Mounting method for semiconductor element | |
| JPH10208314A (en) | Manufacture of optical disk, and device used for the same | |
| JPS5471980A (en) | Adhesion method of semiconductor wafer to lapping surface plate | |
| JPS553904A (en) | Adhering method | |
| EP0189112A3 (en) | Process for the manufacture of a decorative material | |
| JPS57207021A (en) | Laminating method of hotmelt film on water-proof sheet | |
| JPS57188833A (en) | Connecting method for material to be connected | |
| JPS5637638A (en) | Manufacturing of semiconductor device | |
| JPS5586125A (en) | Mounting method of semiconductor device | |
| GB1325293A (en) | Method of making sequin-patterned cloth | |
| JPS5795652A (en) | Semiconductor device | |
| JPS57108263A (en) | Producing device for thin film pattern | |
| JPS57100026A (en) | Manufacture of interior material | |
| JPS5552233A (en) | Masking sheet | |
| JPS6478735A (en) | Substrate sticking method | |
| JPS5714488A (en) | Ultrasonic depositing method | |
| JPS5630732A (en) | Mounting method of semiconductor pellet | |
| KR880001485B1 (en) | Sticking method of applique | |
| JPS57159670A (en) | Adhering method | |
| JPS5624147A (en) | Repair of urethane molded article surface | |
| GB2043539A (en) | Method and covering for the printing of a substrate | |
| JPS5660025A (en) | Bonding method for semiconductor element | |
| JPS5617225A (en) | Bonding method for plane fastener member |