JPS5465477A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS5465477A JPS5465477A JP13264277A JP13264277A JPS5465477A JP S5465477 A JPS5465477 A JP S5465477A JP 13264277 A JP13264277 A JP 13264277A JP 13264277 A JP13264277 A JP 13264277A JP S5465477 A JPS5465477 A JP S5465477A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- base
- resin
- mesa groove
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13264277A JPS5951741B2 (ja) | 1977-11-04 | 1977-11-04 | 樹脂封止形半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13264277A JPS5951741B2 (ja) | 1977-11-04 | 1977-11-04 | 樹脂封止形半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5465477A true JPS5465477A (en) | 1979-05-26 |
JPS5951741B2 JPS5951741B2 (ja) | 1984-12-15 |
Family
ID=15086090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13264277A Expired JPS5951741B2 (ja) | 1977-11-04 | 1977-11-04 | 樹脂封止形半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5951741B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |
WO2017099122A1 (ja) * | 2015-12-11 | 2017-06-15 | ローム株式会社 | 半導体装置 |
US10892319B2 (en) | 2016-08-19 | 2021-01-12 | Rohm Co., Ltd. | Semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0581038U (ja) * | 1992-03-31 | 1993-11-02 | トッパン・ムーア株式会社 | カード付き封筒 |
-
1977
- 1977-11-04 JP JP13264277A patent/JPS5951741B2/ja not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017099122A1 (ja) * | 2015-12-11 | 2017-06-15 | ローム株式会社 | 半導体装置 |
JPWO2017099122A1 (ja) * | 2015-12-11 | 2018-09-27 | ローム株式会社 | 半導体装置 |
US10366905B2 (en) | 2015-12-11 | 2019-07-30 | Rohm Co., Ltd. | Semiconductor device |
US10832922B2 (en) | 2015-12-11 | 2020-11-10 | Rohm Co., Ltd. | Semiconductor device |
JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |
US10892319B2 (en) | 2016-08-19 | 2021-01-12 | Rohm Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5951741B2 (ja) | 1984-12-15 |
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