JPS5461472A - Package for semiconductor element - Google Patents

Package for semiconductor element

Info

Publication number
JPS5461472A
JPS5461472A JP12750377A JP12750377A JPS5461472A JP S5461472 A JPS5461472 A JP S5461472A JP 12750377 A JP12750377 A JP 12750377A JP 12750377 A JP12750377 A JP 12750377A JP S5461472 A JPS5461472 A JP S5461472A
Authority
JP
Japan
Prior art keywords
spacer
semiconductor element
tightness
substrate
providing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12750377A
Other languages
Japanese (ja)
Other versions
JPS62582B2 (en
Inventor
Masao Sekihashi
Michiaki Furukawa
Mitsuo Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12750377A priority Critical patent/JPS5461472A/en
Publication of JPS5461472A publication Critical patent/JPS5461472A/en
Publication of JPS62582B2 publication Critical patent/JPS62582B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve the air-tightness of the semiconductor package, by providing the cushion plate consisting of the metal having almost the same thermal expansion coefficient as that of the spacer.
CONSTITUTION: Much heat is developed from the semiconductor element 11, the temperature of the substrate 10, spacer 13 and cover 16 is increased, and it decreases at assembly. According to it, each part makes expansion and contract. But, by providing the cushion plate 12 made of cobalt which is about close to the thermal expansion coefficient of the spacer 13, between the substrate 10 and the spacer 13, no strss is caused, due to the difference in elongation between them, and no cracking is produced for the spacer and the air- tightness can be maintained
COPYRIGHT: (C)1979,JPO&Japio
JP12750377A 1977-10-26 1977-10-26 Package for semiconductor element Granted JPS5461472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12750377A JPS5461472A (en) 1977-10-26 1977-10-26 Package for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12750377A JPS5461472A (en) 1977-10-26 1977-10-26 Package for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5461472A true JPS5461472A (en) 1979-05-17
JPS62582B2 JPS62582B2 (en) 1987-01-08

Family

ID=14961579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12750377A Granted JPS5461472A (en) 1977-10-26 1977-10-26 Package for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5461472A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59131163U (en) * 1983-02-23 1984-09-03 日本特殊陶業株式会社 semiconductor container

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522316U (en) * 1991-07-11 1993-03-23 ジーエーシ株式会社 Prefabricated box

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59131163U (en) * 1983-02-23 1984-09-03 日本特殊陶業株式会社 semiconductor container
JPS6331394Y2 (en) * 1983-02-23 1988-08-22

Also Published As

Publication number Publication date
JPS62582B2 (en) 1987-01-08

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