JPS5461472A - Package for semiconductor element - Google Patents
Package for semiconductor elementInfo
- Publication number
- JPS5461472A JPS5461472A JP12750377A JP12750377A JPS5461472A JP S5461472 A JPS5461472 A JP S5461472A JP 12750377 A JP12750377 A JP 12750377A JP 12750377 A JP12750377 A JP 12750377A JP S5461472 A JPS5461472 A JP S5461472A
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- semiconductor element
- tightness
- substrate
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To improve the air-tightness of the semiconductor package, by providing the cushion plate consisting of the metal having almost the same thermal expansion coefficient as that of the spacer.
CONSTITUTION: Much heat is developed from the semiconductor element 11, the temperature of the substrate 10, spacer 13 and cover 16 is increased, and it decreases at assembly. According to it, each part makes expansion and contract. But, by providing the cushion plate 12 made of cobalt which is about close to the thermal expansion coefficient of the spacer 13, between the substrate 10 and the spacer 13, no strss is caused, due to the difference in elongation between them, and no cracking is produced for the spacer and the air- tightness can be maintained
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12750377A JPS5461472A (en) | 1977-10-26 | 1977-10-26 | Package for semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12750377A JPS5461472A (en) | 1977-10-26 | 1977-10-26 | Package for semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5461472A true JPS5461472A (en) | 1979-05-17 |
JPS62582B2 JPS62582B2 (en) | 1987-01-08 |
Family
ID=14961579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12750377A Granted JPS5461472A (en) | 1977-10-26 | 1977-10-26 | Package for semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5461472A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59131163U (en) * | 1983-02-23 | 1984-09-03 | 日本特殊陶業株式会社 | semiconductor container |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0522316U (en) * | 1991-07-11 | 1993-03-23 | ジーエーシ株式会社 | Prefabricated box |
-
1977
- 1977-10-26 JP JP12750377A patent/JPS5461472A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59131163U (en) * | 1983-02-23 | 1984-09-03 | 日本特殊陶業株式会社 | semiconductor container |
JPS6331394Y2 (en) * | 1983-02-23 | 1988-08-22 |
Also Published As
Publication number | Publication date |
---|---|
JPS62582B2 (en) | 1987-01-08 |
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