JPS54572A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPS54572A JPS54572A JP6537877A JP6537877A JPS54572A JP S54572 A JPS54572 A JP S54572A JP 6537877 A JP6537877 A JP 6537877A JP 6537877 A JP6537877 A JP 6537877A JP S54572 A JPS54572 A JP S54572A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- heat radiating
- radiating part
- identification marks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To facilitate control by putting identification marks to the heat radiating part of a lead frame.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6537877A JPS54572A (en) | 1977-06-02 | 1977-06-02 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6537877A JPS54572A (en) | 1977-06-02 | 1977-06-02 | Lead frame for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54572A true JPS54572A (en) | 1979-01-05 |
Family
ID=13285241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6537877A Pending JPS54572A (en) | 1977-06-02 | 1977-06-02 | Lead frame for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54572A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58151048A (en) * | 1982-03-03 | 1983-09-08 | Toshiba Corp | Preparation of semiconductor device |
JP2015149341A (en) * | 2014-02-05 | 2015-08-20 | 日本電気株式会社 | Connection member, electronic component, and information display method |
-
1977
- 1977-06-02 JP JP6537877A patent/JPS54572A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58151048A (en) * | 1982-03-03 | 1983-09-08 | Toshiba Corp | Preparation of semiconductor device |
JP2015149341A (en) * | 2014-02-05 | 2015-08-20 | 日本電気株式会社 | Connection member, electronic component, and information display method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS54572A (en) | Lead frame for semiconductor device | |
JPS525273A (en) | Transistor | |
JPS5230167A (en) | Method for production of semiconductor device | |
JPS53133371A (en) | Lead frame of plastic package for integrated circuit | |
JPS5225572A (en) | Resin-seal type semiconductor device | |
JPS5218173A (en) | Soldering method of semiconductor element | |
JPS52128068A (en) | Manufacture of cooling piece for semiconductor rectifying device | |
JPS5419656A (en) | Bonding tool | |
JPS5241527A (en) | Electromagnetic shutter | |
JPS5430135A (en) | 4-hydroxy-4-methyl-cyclohexene-2-one-1 | |
JPS5387637A (en) | Loop control system | |
JPS524330A (en) | Volleyball toss lifter | |
JPS5418280A (en) | Resin sealed semiconductor device | |
JPS5225225A (en) | Rectifying device | |
JPS5425394A (en) | Temperature control circuit using heat sensitive thyristor | |
JPS51134949A (en) | High-frequency heating device | |
JPS53118305A (en) | Automatic editing device | |
JPS53126275A (en) | Semiconductor device | |
JPS53128980A (en) | Positioning device for bonding | |
JPS5411671A (en) | Sealing method of semiconductor device | |
JPS547866A (en) | Manufacture for semiconductor device | |
JPS5221649A (en) | Constant-voltage circuit | |
JPS5243187A (en) | Automatic shearing machine | |
JPS53144671A (en) | Production of semiconductor device | |
JPS523281A (en) | Lighting device |