JPS5456504A - Method of forming pattern thin film - Google Patents

Method of forming pattern thin film

Info

Publication number
JPS5456504A
JPS5456504A JP10921478A JP10921478A JPS5456504A JP S5456504 A JPS5456504 A JP S5456504A JP 10921478 A JP10921478 A JP 10921478A JP 10921478 A JP10921478 A JP 10921478A JP S5456504 A JPS5456504 A JP S5456504A
Authority
JP
Japan
Prior art keywords
thin film
forming pattern
pattern thin
forming
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10921478A
Other languages
English (en)
Inventor
Aaru Daia Donarudo
Jiyonson Jiyunia Kuroodo
Aaru Uirubaagu Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5456504A publication Critical patent/JPS5456504A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP10921478A 1977-09-29 1978-09-07 Method of forming pattern thin film Pending JPS5456504A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/837,675 US4115120A (en) 1977-09-29 1977-09-29 Method of forming thin film patterns by differential pre-baking of resist

Publications (1)

Publication Number Publication Date
JPS5456504A true JPS5456504A (en) 1979-05-07

Family

ID=25275107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10921478A Pending JPS5456504A (en) 1977-09-29 1978-09-07 Method of forming pattern thin film

Country Status (4)

Country Link
US (1) US4115120A (ja)
EP (1) EP0001429B1 (ja)
JP (1) JPS5456504A (ja)
DE (1) DE2860605D1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037553A1 (ja) * 2005-09-30 2007-04-05 Zeon Corporation 金属配線付き基板の製造方法
JP2017012537A (ja) * 2015-07-02 2017-01-19 株式会社エムダップ 医療器具の製造方法

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1578259A (en) * 1977-05-11 1980-11-05 Philips Electronic Associated Methods of manufacturing solid-state devices apparatus for use therein and devices manufactured thereby
US4218532A (en) * 1977-10-13 1980-08-19 Bell Telephone Laboratories, Incorporated Photolithographic technique for depositing thin films
DE2828625C2 (de) * 1978-06-29 1980-06-19 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur galvanoplastischen Herstellung von Präzisionsflachteilen
US4181755A (en) * 1978-11-21 1980-01-01 Rca Corporation Thin film pattern generation by an inverse self-lifting technique
US4284706A (en) * 1979-12-03 1981-08-18 International Business Machines Corporation Lithographic resist composition for a lift-off process
JPS5730829A (en) * 1980-08-01 1982-02-19 Hitachi Ltd Micropattern formation method
US4526810A (en) * 1982-06-17 1985-07-02 At&T Technologies, Inc. Process for improved wall definition of an additive printed circuit
KR860002082B1 (ko) * 1983-01-19 1986-11-24 가부시기가이샤 도시바 레지스트 패턴의 형성 방법 및 장치
DE3305923C2 (de) * 1983-02-21 1986-10-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Vorbacken von mit Positiv-Fotolack auf der Basis von Naphtoquinondiazid und Phenolformaldehydharz beschichteten Substraten
DE3314602A1 (de) * 1983-04-22 1984-10-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur fotolithografischen herstellung von strukturen
US4568631A (en) * 1984-04-30 1986-02-04 International Business Machines Corporation Process for delineating photoresist lines at pattern edges only using image reversal composition with diazoquinone
DE3580978D1 (de) * 1984-12-21 1991-01-31 Toshiba Kawasaki Kk Verfahren zur herstellung von resistmustern.
JPS6381820A (ja) * 1986-09-25 1988-04-12 Toshiba Corp レジストパタ−ン形成方法
US4826754A (en) * 1987-04-27 1989-05-02 Microelectronics Center Of North Carolina Method for anisotropically hardening a protective coating for integrated circuit manufacture
US5064748A (en) * 1987-04-27 1991-11-12 Mcnc Method for anisotropically hardening a protective coating for integrated circuit manufacture
US4758094A (en) * 1987-05-15 1988-07-19 Kla Instruments Corp. Process and apparatus for in-situ qualification of master patterns used in patterning systems
JPH0626201B2 (ja) * 1987-10-15 1994-04-06 富士通株式会社 半導体装置の製造方法
US5225771A (en) * 1988-05-16 1993-07-06 Dri Technology Corp. Making and testing an integrated circuit using high density probe points
US6288561B1 (en) * 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
US5103557A (en) * 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
JPH06122869A (ja) * 1991-06-28 1994-05-06 Texas Instr Inc <Ti> 微細蝕刻における測定のための帯電防止溶液
DE69818485T2 (de) 1997-08-14 2004-07-22 Kodak Polychrome Graphics Co. Ltd., Norwalk Verfahren zur herstellung von elektronischen bauteilen
GB9722861D0 (en) 1997-10-29 1997-12-24 Horsell Graphic Ind Ltd Improvements in relation to the manufacture of lithographic printing forms
US6544902B1 (en) * 1999-02-26 2003-04-08 Micron Technology, Inc. Energy beam patterning of protective layers for semiconductor devices
JP3489576B2 (ja) * 2001-01-12 2004-01-19 株式会社村田製作所 レジストパターンの形成方法、電極パターンの形成方法および弾性表面波装置の製造方法
US6797586B2 (en) * 2001-06-28 2004-09-28 Koninklijke Philips Electronics N.V. Silicon carbide schottky barrier diode and method of making
WO2004047194A2 (de) * 2002-11-19 2004-06-03 Polyic Gmbh & Co.Kg Organisches elektronisches bauelement mit gleichem organischem material für zumindest zwei funktionsschichten
ATE502289T1 (de) * 2006-02-15 2011-04-15 Grundfos Management As Verfahren zur herstellung von elektronischen bauelementen und drucksensor
EP2105950A1 (en) * 2008-03-27 2009-09-30 United Radiant Technology Corp. Thin film etching method
KR20180089606A (ko) * 2017-01-31 2018-08-09 삼성디스플레이 주식회사 마스크 어셈블리의 제조 방법
CN107863291B (zh) * 2017-11-08 2020-06-26 西安电子科技大学 一种制作t型栅结构的电子束光刻方法
SE541452C2 (en) * 2018-02-22 2019-10-08 Solibro Res Ab Method for patterning a surface with a metal by controlling the generation of cracks or gaps in a deposited metal layer
CN108803261A (zh) * 2018-06-08 2018-11-13 大连芯冠科技有限公司 方便单层正胶剥离的金属图形加工方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3669661A (en) * 1970-03-06 1972-06-13 Westinghouse Electric Corp Method of producing thin film transistors
US3799777A (en) * 1972-06-20 1974-03-26 Westinghouse Electric Corp Micro-miniature electronic components by double rejection
US3867148A (en) * 1974-01-08 1975-02-18 Westinghouse Electric Corp Making of micro-miniature electronic components by selective oxidation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037553A1 (ja) * 2005-09-30 2007-04-05 Zeon Corporation 金属配線付き基板の製造方法
JP4978800B2 (ja) * 2005-09-30 2012-07-18 日本ゼオン株式会社 金属配線付き基板の製造方法
JP2017012537A (ja) * 2015-07-02 2017-01-19 株式会社エムダップ 医療器具の製造方法

Also Published As

Publication number Publication date
EP0001429B1 (de) 1981-04-08
US4115120A (en) 1978-09-19
DE2860605D1 (en) 1981-04-30
EP0001429A1 (de) 1979-04-18

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