JPS545287A - Wire-cut processing device - Google Patents
Wire-cut processing deviceInfo
- Publication number
- JPS545287A JPS545287A JP7024877A JP7024877A JPS545287A JP S545287 A JPS545287 A JP S545287A JP 7024877 A JP7024877 A JP 7024877A JP 7024877 A JP7024877 A JP 7024877A JP S545287 A JPS545287 A JP S545287A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- processing device
- cut processing
- cut
- electrolyte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To provide a wire-cut processing device capable of working at a high efficiency, in which the processing is effected by free grains supplied to the space between the wire and the processed body, with a supply of an electrolyte and electric current.
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7024877A JPS545287A (en) | 1977-06-14 | 1977-06-14 | Wire-cut processing device |
GB7826779A GB2000055B (en) | 1977-06-14 | 1978-06-13 | Method of and apparatus for shaping workpieces |
US05/915,206 US4193852A (en) | 1977-06-14 | 1978-06-13 | Method and apparatus for electrical machining with a multi-guided travelling electrode |
DE2825868A DE2825868C2 (en) | 1977-06-14 | 1978-06-13 | Machining device with a multi-guided running wire electrode |
GB7826780A GB2000069B (en) | 1977-06-14 | 1978-06-13 | Improvements relating to electrical machining |
DE19782826069 DE2826069A1 (en) | 1977-06-14 | 1978-06-14 | PROFILE FORMING METHOD AND DEVICE WITH AXIAL MOVING CONTINUOUSLY LONG-EXTENDED TOOL |
FR7817788A FR2394361A1 (en) | 1977-06-14 | 1978-06-14 | CONTINUOUS CIRCULATING TOOL MACHINING METHOD AND APPARATUS |
IT7849877A IT1105209B (en) | 1977-06-14 | 1978-06-14 | METHOD AND EQUIPMENT FOR THE PROCESSING OF A PIECE WITH AXIAL MOBILE CONTINUOUS TOOL |
IT7849878A IT1105210B (en) | 1977-06-14 | 1978-06-14 | EQUIPMENT FOR ELECTRICAL PROCESSING WITH A MOBILE MULTIPLE GUIDE ELECTRODE |
FR7817789A FR2394360A1 (en) | 1977-06-14 | 1978-06-14 | ELECTRIC MACHINING APPARATUS WITH CIRCULATING MACHINING ELECTRODE |
US06/120,107 US4379042A (en) | 1977-06-14 | 1980-02-08 | Apparatus using an axially moving continuous elongated tool |
US06/658,441 US4596640A (en) | 1977-06-14 | 1984-10-05 | Shaping method and apparatus using an axially moving continuous elongated tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7024877A JPS545287A (en) | 1977-06-14 | 1977-06-14 | Wire-cut processing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS545287A true JPS545287A (en) | 1979-01-16 |
Family
ID=13426060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7024877A Pending JPS545287A (en) | 1977-06-14 | 1977-06-14 | Wire-cut processing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS545287A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10238593A1 (en) * | 2002-08-22 | 2004-03-11 | Wacker Siltronic Ag | Production of a semiconductor wafer from a semiconducting workpiece comprises subjecting a conducting tool as electrode to an electrical current from a direct voltage source, and applying to the workpiece in the presence of an electrolyte |
CN103157859A (en) * | 2013-03-20 | 2013-06-19 | 南京航空航天大学 | Unilateral wire loosening elimination method of cutting wire electrodes through reciprocating wire moving electrical discharge wires |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4928716A (en) * | 1972-07-13 | 1974-03-14 |
-
1977
- 1977-06-14 JP JP7024877A patent/JPS545287A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4928716A (en) * | 1972-07-13 | 1974-03-14 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10238593A1 (en) * | 2002-08-22 | 2004-03-11 | Wacker Siltronic Ag | Production of a semiconductor wafer from a semiconducting workpiece comprises subjecting a conducting tool as electrode to an electrical current from a direct voltage source, and applying to the workpiece in the presence of an electrolyte |
CN103157859A (en) * | 2013-03-20 | 2013-06-19 | 南京航空航天大学 | Unilateral wire loosening elimination method of cutting wire electrodes through reciprocating wire moving electrical discharge wires |
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