JPS5442869B2 - - Google Patents
Info
- Publication number
- JPS5442869B2 JPS5442869B2 JP12936176A JP12936176A JPS5442869B2 JP S5442869 B2 JPS5442869 B2 JP S5442869B2 JP 12936176 A JP12936176 A JP 12936176A JP 12936176 A JP12936176 A JP 12936176A JP S5442869 B2 JPS5442869 B2 JP S5442869B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12936176A JPS5355441A (en) | 1976-10-29 | 1976-10-29 | Brazing filler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12936176A JPS5355441A (en) | 1976-10-29 | 1976-10-29 | Brazing filler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5355441A JPS5355441A (en) | 1978-05-19 |
| JPS5442869B2 true JPS5442869B2 (en) | 1979-12-17 |
Family
ID=15007679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12936176A Granted JPS5355441A (en) | 1976-10-29 | 1976-10-29 | Brazing filler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5355441A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817456A (en) * | 2014-03-03 | 2014-05-28 | 金华市双环钎焊材料有限公司 | Beryllium-containing low-silver cadmium-free silver solder |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942471B (en) * | 2013-01-16 | 2017-05-03 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| EP2832488A1 (en) * | 2013-07-31 | 2015-02-04 | Umicore AG & Co. KG | Brazing alloys |
| CN105149809B (en) * | 2015-10-10 | 2017-09-26 | 南京青锐风新材料科技有限公司 | It is a kind of suitable for antioxidant of SnAgCu or SnCu solders and preparation method thereof |
-
1976
- 1976-10-29 JP JP12936176A patent/JPS5355441A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817456A (en) * | 2014-03-03 | 2014-05-28 | 金华市双环钎焊材料有限公司 | Beryllium-containing low-silver cadmium-free silver solder |
| CN103817456B (en) * | 2014-03-03 | 2015-12-02 | 金华市双环钎焊材料有限公司 | Containing the low silver-colored cadmium-free silver brazing alloy of beryllium |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5355441A (en) | 1978-05-19 |