JPS543468A - Glass sealing-type semiconductor device - Google Patents

Glass sealing-type semiconductor device

Info

Publication number
JPS543468A
JPS543468A JP6795677A JP6795677A JPS543468A JP S543468 A JPS543468 A JP S543468A JP 6795677 A JP6795677 A JP 6795677A JP 6795677 A JP6795677 A JP 6795677A JP S543468 A JPS543468 A JP S543468A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
glass sealing
featuring
semicircular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6795677A
Other languages
Japanese (ja)
Other versions
JPS5531622B2 (en
Inventor
Kensuke Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6795677A priority Critical patent/JPS543468A/en
Publication of JPS543468A publication Critical patent/JPS543468A/en
Publication of JPS5531622B2 publication Critical patent/JPS5531622B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce the uneven plating measurement caused by the surface tension and thus to obtain a metal coat featuring a high measurement accuracy, by forming in advance the semicircular or V-shaped groove to the columnar body which contains header parts at one end with a space.
COPYRIGHT: (C)1979,JPO&Japio
JP6795677A 1977-06-10 1977-06-10 Glass sealing-type semiconductor device Granted JPS543468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6795677A JPS543468A (en) 1977-06-10 1977-06-10 Glass sealing-type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6795677A JPS543468A (en) 1977-06-10 1977-06-10 Glass sealing-type semiconductor device

Publications (2)

Publication Number Publication Date
JPS543468A true JPS543468A (en) 1979-01-11
JPS5531622B2 JPS5531622B2 (en) 1980-08-19

Family

ID=13359907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6795677A Granted JPS543468A (en) 1977-06-10 1977-06-10 Glass sealing-type semiconductor device

Country Status (1)

Country Link
JP (1) JPS543468A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121936A (en) * 1984-11-20 1986-06-09 昭和鋼機株式会社 Fusion cutting-resistant laminated board
US5760482A (en) * 1995-03-20 1998-06-02 U.S. Philips Corporation Semiconductor device of the type sealed in glass comprising a semiconductor body connected to slugs by means of a silver-aluminum bonding layer

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718286A (en) * 1980-07-08 1982-01-30 Seiko Epson Corp Printer
JPS599843U (en) * 1982-07-13 1984-01-21 ジューキ株式会社 Ink ribbon loading device in printer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121936A (en) * 1984-11-20 1986-06-09 昭和鋼機株式会社 Fusion cutting-resistant laminated board
JPH0463775B2 (en) * 1984-11-20 1992-10-12 Showa Koki Kk
US5760482A (en) * 1995-03-20 1998-06-02 U.S. Philips Corporation Semiconductor device of the type sealed in glass comprising a semiconductor body connected to slugs by means of a silver-aluminum bonding layer

Also Published As

Publication number Publication date
JPS5531622B2 (en) 1980-08-19

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