JPS5432063A - Si semiconductor solder - Google Patents
Si semiconductor solderInfo
- Publication number
- JPS5432063A JPS5432063A JP9751777A JP9751777A JPS5432063A JP S5432063 A JPS5432063 A JP S5432063A JP 9751777 A JP9751777 A JP 9751777A JP 9751777 A JP9751777 A JP 9751777A JP S5432063 A JPS5432063 A JP S5432063A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor solder
- solder
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9751777A JPS5432063A (en) | 1977-08-16 | 1977-08-16 | Si semiconductor solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9751777A JPS5432063A (en) | 1977-08-16 | 1977-08-16 | Si semiconductor solder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5432063A true JPS5432063A (en) | 1979-03-09 |
Family
ID=14194439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9751777A Pending JPS5432063A (en) | 1977-08-16 | 1977-08-16 | Si semiconductor solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5432063A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007190562A (en) * | 2006-01-17 | 2007-08-02 | Matsushita Electric Ind Co Ltd | Solder material, its production method and joined structure |
JP2012055905A (en) * | 2010-09-07 | 2012-03-22 | Sumitomo Metal Mining Co Ltd | Pb-FREE SOLDER ALLOY CONSISTING MAINLY OF Zn |
JP2012228729A (en) * | 2011-04-27 | 2012-11-22 | Sumitomo Metal Mining Co Ltd | Pb FREE SOLDER ALLOY MAKING Zn PRINCIPAL INGREDIENT AND METHOD OF MANUFACTURING THE SAME |
US20120319280A1 (en) * | 2010-03-01 | 2012-12-20 | Osaka University | Semiconductor device and bonding material for semiconductor device |
JP2013081995A (en) * | 2011-10-12 | 2013-05-09 | Sumitomo Metal Mining Co Ltd | Pb-FREE SOLDER ALLOY INCLUDING Zn AS MAIN COMPONENT |
JP2013132643A (en) * | 2011-12-22 | 2013-07-08 | Hitachi Chemical Co Ltd | Solder adhesion body |
JP2015042409A (en) * | 2013-08-26 | 2015-03-05 | 住友金属鉱山株式会社 | CLAD MATERIAL OF Pb-FREE-Zn-Al ALLOY SOLDER AND METAL BASE MATERIAL, AND MANUFACTURING METHOD THEREOF |
JP2015066592A (en) * | 2013-09-30 | 2015-04-13 | 福田金属箔粉工業株式会社 | Low melting point zinc base brazing alloy having high strength and high ductility |
-
1977
- 1977-08-16 JP JP9751777A patent/JPS5432063A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007190562A (en) * | 2006-01-17 | 2007-08-02 | Matsushita Electric Ind Co Ltd | Solder material, its production method and joined structure |
JP4703411B2 (en) * | 2006-01-17 | 2011-06-15 | パナソニック株式会社 | Solder material |
US20120319280A1 (en) * | 2010-03-01 | 2012-12-20 | Osaka University | Semiconductor device and bonding material for semiconductor device |
US9217192B2 (en) * | 2010-03-01 | 2015-12-22 | Osaka University | Semiconductor device and bonding material for semiconductor device |
JP2012055905A (en) * | 2010-09-07 | 2012-03-22 | Sumitomo Metal Mining Co Ltd | Pb-FREE SOLDER ALLOY CONSISTING MAINLY OF Zn |
JP2012228729A (en) * | 2011-04-27 | 2012-11-22 | Sumitomo Metal Mining Co Ltd | Pb FREE SOLDER ALLOY MAKING Zn PRINCIPAL INGREDIENT AND METHOD OF MANUFACTURING THE SAME |
JP2013081995A (en) * | 2011-10-12 | 2013-05-09 | Sumitomo Metal Mining Co Ltd | Pb-FREE SOLDER ALLOY INCLUDING Zn AS MAIN COMPONENT |
JP2013132643A (en) * | 2011-12-22 | 2013-07-08 | Hitachi Chemical Co Ltd | Solder adhesion body |
JP2015042409A (en) * | 2013-08-26 | 2015-03-05 | 住友金属鉱山株式会社 | CLAD MATERIAL OF Pb-FREE-Zn-Al ALLOY SOLDER AND METAL BASE MATERIAL, AND MANUFACTURING METHOD THEREOF |
JP2015066592A (en) * | 2013-09-30 | 2015-04-13 | 福田金属箔粉工業株式会社 | Low melting point zinc base brazing alloy having high strength and high ductility |
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