JPS5432063A - Si semiconductor solder - Google Patents

Si semiconductor solder

Info

Publication number
JPS5432063A
JPS5432063A JP9751777A JP9751777A JPS5432063A JP S5432063 A JPS5432063 A JP S5432063A JP 9751777 A JP9751777 A JP 9751777A JP 9751777 A JP9751777 A JP 9751777A JP S5432063 A JPS5432063 A JP S5432063A
Authority
JP
Japan
Prior art keywords
semiconductor solder
solder
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9751777A
Other languages
Japanese (ja)
Inventor
Tooru Iseda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP9751777A priority Critical patent/JPS5432063A/en
Publication of JPS5432063A publication Critical patent/JPS5432063A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP9751777A 1977-08-16 1977-08-16 Si semiconductor solder Pending JPS5432063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9751777A JPS5432063A (en) 1977-08-16 1977-08-16 Si semiconductor solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9751777A JPS5432063A (en) 1977-08-16 1977-08-16 Si semiconductor solder

Publications (1)

Publication Number Publication Date
JPS5432063A true JPS5432063A (en) 1979-03-09

Family

ID=14194439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9751777A Pending JPS5432063A (en) 1977-08-16 1977-08-16 Si semiconductor solder

Country Status (1)

Country Link
JP (1) JPS5432063A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007190562A (en) * 2006-01-17 2007-08-02 Matsushita Electric Ind Co Ltd Solder material, its production method and joined structure
JP2012055905A (en) * 2010-09-07 2012-03-22 Sumitomo Metal Mining Co Ltd Pb-FREE SOLDER ALLOY CONSISTING MAINLY OF Zn
JP2012228729A (en) * 2011-04-27 2012-11-22 Sumitomo Metal Mining Co Ltd Pb FREE SOLDER ALLOY MAKING Zn PRINCIPAL INGREDIENT AND METHOD OF MANUFACTURING THE SAME
US20120319280A1 (en) * 2010-03-01 2012-12-20 Osaka University Semiconductor device and bonding material for semiconductor device
JP2013081995A (en) * 2011-10-12 2013-05-09 Sumitomo Metal Mining Co Ltd Pb-FREE SOLDER ALLOY INCLUDING Zn AS MAIN COMPONENT
JP2013132643A (en) * 2011-12-22 2013-07-08 Hitachi Chemical Co Ltd Solder adhesion body
JP2015042409A (en) * 2013-08-26 2015-03-05 住友金属鉱山株式会社 CLAD MATERIAL OF Pb-FREE-Zn-Al ALLOY SOLDER AND METAL BASE MATERIAL, AND MANUFACTURING METHOD THEREOF
JP2015066592A (en) * 2013-09-30 2015-04-13 福田金属箔粉工業株式会社 Low melting point zinc base brazing alloy having high strength and high ductility

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007190562A (en) * 2006-01-17 2007-08-02 Matsushita Electric Ind Co Ltd Solder material, its production method and joined structure
JP4703411B2 (en) * 2006-01-17 2011-06-15 パナソニック株式会社 Solder material
US20120319280A1 (en) * 2010-03-01 2012-12-20 Osaka University Semiconductor device and bonding material for semiconductor device
US9217192B2 (en) * 2010-03-01 2015-12-22 Osaka University Semiconductor device and bonding material for semiconductor device
JP2012055905A (en) * 2010-09-07 2012-03-22 Sumitomo Metal Mining Co Ltd Pb-FREE SOLDER ALLOY CONSISTING MAINLY OF Zn
JP2012228729A (en) * 2011-04-27 2012-11-22 Sumitomo Metal Mining Co Ltd Pb FREE SOLDER ALLOY MAKING Zn PRINCIPAL INGREDIENT AND METHOD OF MANUFACTURING THE SAME
JP2013081995A (en) * 2011-10-12 2013-05-09 Sumitomo Metal Mining Co Ltd Pb-FREE SOLDER ALLOY INCLUDING Zn AS MAIN COMPONENT
JP2013132643A (en) * 2011-12-22 2013-07-08 Hitachi Chemical Co Ltd Solder adhesion body
JP2015042409A (en) * 2013-08-26 2015-03-05 住友金属鉱山株式会社 CLAD MATERIAL OF Pb-FREE-Zn-Al ALLOY SOLDER AND METAL BASE MATERIAL, AND MANUFACTURING METHOD THEREOF
JP2015066592A (en) * 2013-09-30 2015-04-13 福田金属箔粉工業株式会社 Low melting point zinc base brazing alloy having high strength and high ductility

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