JPS5429566A - Mo lded type electric component - Google Patents
Mo lded type electric componentInfo
- Publication number
- JPS5429566A JPS5429566A JP9530777A JP9530777A JPS5429566A JP S5429566 A JPS5429566 A JP S5429566A JP 9530777 A JP9530777 A JP 9530777A JP 9530777 A JP9530777 A JP 9530777A JP S5429566 A JPS5429566 A JP S5429566A
- Authority
- JP
- Japan
- Prior art keywords
- lded
- type electric
- electric component
- resin
- display plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
PURPOSE: To block the occurrence of turbulent flow of resin and to reduce air bubbles, by providing a projection on the display plate at lower stream of the resin flow, when the light emission diode mounted on the frame shaped leads in a metal mold and the display plate are located for resin sealing.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9530777A JPS5429566A (en) | 1977-08-08 | 1977-08-08 | Mo lded type electric component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9530777A JPS5429566A (en) | 1977-08-08 | 1977-08-08 | Mo lded type electric component |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5429566A true JPS5429566A (en) | 1979-03-05 |
JPS6249755B2 JPS6249755B2 (en) | 1987-10-21 |
Family
ID=14134098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9530777A Granted JPS5429566A (en) | 1977-08-08 | 1977-08-08 | Mo lded type electric component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5429566A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61237485A (en) * | 1985-04-12 | 1986-10-22 | Takiron Co Ltd | Manufacture of light-emission display body |
JP2009088520A (en) * | 2007-09-27 | 2009-04-23 | Samsung Electro Mech Co Ltd | Method of manufacturing light-emitting diode package |
-
1977
- 1977-08-08 JP JP9530777A patent/JPS5429566A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61237485A (en) * | 1985-04-12 | 1986-10-22 | Takiron Co Ltd | Manufacture of light-emission display body |
JP2009088520A (en) * | 2007-09-27 | 2009-04-23 | Samsung Electro Mech Co Ltd | Method of manufacturing light-emitting diode package |
US8202746B2 (en) | 2007-09-27 | 2012-06-19 | Samsung Led Co., Ltd. | Method of manufacturing LED package for formation of molding member |
Also Published As
Publication number | Publication date |
---|---|
JPS6249755B2 (en) | 1987-10-21 |
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