JPS5426476A - Reflow solder dipping device - Google Patents

Reflow solder dipping device

Info

Publication number
JPS5426476A
JPS5426476A JP9186277A JP9186277A JPS5426476A JP S5426476 A JPS5426476 A JP S5426476A JP 9186277 A JP9186277 A JP 9186277A JP 9186277 A JP9186277 A JP 9186277A JP S5426476 A JPS5426476 A JP S5426476A
Authority
JP
Japan
Prior art keywords
dipping device
reflow solder
solder dipping
reflow
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9186277A
Other languages
Japanese (ja)
Inventor
Akio Iwamoto
Yoshimasa Oosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Panafacom Ltd
Original Assignee
Fujitsu Ltd
Panafacom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Panafacom Ltd filed Critical Fujitsu Ltd
Priority to JP9186277A priority Critical patent/JPS5426476A/en
Publication of JPS5426476A publication Critical patent/JPS5426476A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9186277A 1977-07-29 1977-07-29 Reflow solder dipping device Pending JPS5426476A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9186277A JPS5426476A (en) 1977-07-29 1977-07-29 Reflow solder dipping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9186277A JPS5426476A (en) 1977-07-29 1977-07-29 Reflow solder dipping device

Publications (1)

Publication Number Publication Date
JPS5426476A true JPS5426476A (en) 1979-02-28

Family

ID=14038354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9186277A Pending JPS5426476A (en) 1977-07-29 1977-07-29 Reflow solder dipping device

Country Status (1)

Country Link
JP (1) JPS5426476A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053095A (en) * 1983-09-02 1985-03-26 株式会社日立製作所 Method of heating solder connection
JPS60111497A (en) * 1983-11-21 1985-06-17 イビデン株式会社 Method and device for placing and connecting chip carrier
JPH0460363U (en) * 1990-09-27 1992-05-25
JPH04321701A (en) * 1991-04-19 1992-11-11 Hitachi Ltd Scroll fluid machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5035047A (en) * 1973-08-01 1975-04-03
JPS5062156A (en) * 1973-10-05 1975-05-28

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5035047A (en) * 1973-08-01 1975-04-03
JPS5062156A (en) * 1973-10-05 1975-05-28

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053095A (en) * 1983-09-02 1985-03-26 株式会社日立製作所 Method of heating solder connection
JPS60111497A (en) * 1983-11-21 1985-06-17 イビデン株式会社 Method and device for placing and connecting chip carrier
JPH0472398B2 (en) * 1983-11-21 1992-11-18 Ibiden Co Ltd
JPH0460363U (en) * 1990-09-27 1992-05-25
JPH04321701A (en) * 1991-04-19 1992-11-11 Hitachi Ltd Scroll fluid machine

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