JPS5425667A - Device for bonding wires - Google Patents

Device for bonding wires

Info

Publication number
JPS5425667A
JPS5425667A JP9126877A JP9126877A JPS5425667A JP S5425667 A JPS5425667 A JP S5425667A JP 9126877 A JP9126877 A JP 9126877A JP 9126877 A JP9126877 A JP 9126877A JP S5425667 A JPS5425667 A JP S5425667A
Authority
JP
Japan
Prior art keywords
bonding wires
wires
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9126877A
Other languages
Japanese (ja)
Inventor
Masashige Irie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP9126877A priority Critical patent/JPS5425667A/en
Publication of JPS5425667A publication Critical patent/JPS5425667A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP9126877A 1977-07-28 1977-07-28 Device for bonding wires Pending JPS5425667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9126877A JPS5425667A (en) 1977-07-28 1977-07-28 Device for bonding wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9126877A JPS5425667A (en) 1977-07-28 1977-07-28 Device for bonding wires

Publications (1)

Publication Number Publication Date
JPS5425667A true JPS5425667A (en) 1979-02-26

Family

ID=14021679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9126877A Pending JPS5425667A (en) 1977-07-28 1977-07-28 Device for bonding wires

Country Status (1)

Country Link
JP (1) JPS5425667A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63240038A (en) * 1987-03-27 1988-10-05 Mitsubishi Electric Corp Wire bonding device
JPH069094U (en) * 1991-12-12 1994-02-04 九州三永金属工業株式会社 Electric wave shield for microwave oven door

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63240038A (en) * 1987-03-27 1988-10-05 Mitsubishi Electric Corp Wire bonding device
JPH069094U (en) * 1991-12-12 1994-02-04 九州三永金属工業株式会社 Electric wave shield for microwave oven door

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