JPS5421974A - Spattering device - Google Patents
Spattering deviceInfo
- Publication number
- JPS5421974A JPS5421974A JP8557277A JP8557277A JPS5421974A JP S5421974 A JPS5421974 A JP S5421974A JP 8557277 A JP8557277 A JP 8557277A JP 8557277 A JP8557277 A JP 8557277A JP S5421974 A JPS5421974 A JP S5421974A
- Authority
- JP
- Japan
- Prior art keywords
- target
- base plate
- spattering device
- confronting
- carrying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Thin Magnetic Films (AREA)
Abstract
PURPOSE:To provide a spattering device of little temperature increase of a base plate and a high film-forming speed, comprising a shield chamber accommodating therein a target, a discharge electrode confronting at least a part of the target, and opening window confronting a base plate, and a mechanism for carrying out operational exhaust.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8557277A JPS5421974A (en) | 1977-07-19 | 1977-07-19 | Spattering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8557277A JPS5421974A (en) | 1977-07-19 | 1977-07-19 | Spattering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5421974A true JPS5421974A (en) | 1979-02-19 |
Family
ID=13862517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8557277A Pending JPS5421974A (en) | 1977-07-19 | 1977-07-19 | Spattering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5421974A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59195323A (en) * | 1983-04-20 | 1984-11-06 | Victor Co Of Japan Ltd | Manufacture of vertical magnetic recording medium |
JPS59215025A (en) * | 1983-05-21 | 1984-12-04 | Ulvac Corp | Manufacture of vertical magnetic recording body |
FR2551460A1 (en) * | 1983-09-02 | 1985-03-08 | Leybold Heraeus Gmbh & Co Kg | METHOD AND DEVICE FOR REACTIVE SPRAY DEPOSITION OF METAL COMPOUNDS AND SEMICONDUCTORS |
JPS63161162A (en) * | 1986-12-23 | 1988-07-04 | Toshiba Corp | Sputtering device |
-
1977
- 1977-07-19 JP JP8557277A patent/JPS5421974A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59195323A (en) * | 1983-04-20 | 1984-11-06 | Victor Co Of Japan Ltd | Manufacture of vertical magnetic recording medium |
JPS59215025A (en) * | 1983-05-21 | 1984-12-04 | Ulvac Corp | Manufacture of vertical magnetic recording body |
JPH0352136B2 (en) * | 1983-05-21 | 1991-08-09 | Ulvac Corp | |
FR2551460A1 (en) * | 1983-09-02 | 1985-03-08 | Leybold Heraeus Gmbh & Co Kg | METHOD AND DEVICE FOR REACTIVE SPRAY DEPOSITION OF METAL COMPOUNDS AND SEMICONDUCTORS |
JPS63161162A (en) * | 1986-12-23 | 1988-07-04 | Toshiba Corp | Sputtering device |
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