JPS54161882A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS54161882A JPS54161882A JP7136878A JP7136878A JPS54161882A JP S54161882 A JPS54161882 A JP S54161882A JP 7136878 A JP7136878 A JP 7136878A JP 7136878 A JP7136878 A JP 7136878A JP S54161882 A JPS54161882 A JP S54161882A
- Authority
- JP
- Japan
- Prior art keywords
- expansion
- sheet
- ring
- constitution
- axle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To obtain an accurate expansion state at all times by detecting the degree of expansion of the semiconductor substrate space caused by expansion of the heat expandable sheet at the utmost outer edge position of the substrate and then stopping the expansion.
CONSTITUTION: Heat expandable sheet 3 with semiconductor element 1 stuck is applied to fixture ring 7, and up-down movable ring 11 is provided to the lower side of sheet 3. When axle 9 is raised up after heating sheet 3, the space of element 1 is expanded by extension of sheet 3, and the element at the utmost outer edge moves above photo sensor 12 and 13 to cut off the light. At this moment the photoelectric signal disappears, the rising of axle 9 is stopped to end the expansion. After this, ring 14 is fitted to ring 11 to fix sheet 3. Ring 11 is detachable from support part 10. In such constitution, an accurate expansion state is secured at all times with elimination of the uneven expansion, and also the pickup can be prevented for the adjacent elements.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7136878A JPS54161882A (en) | 1978-06-12 | 1978-06-12 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7136878A JPS54161882A (en) | 1978-06-12 | 1978-06-12 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54161882A true JPS54161882A (en) | 1979-12-21 |
JPS5728949B2 JPS5728949B2 (en) | 1982-06-19 |
Family
ID=13458480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7136878A Granted JPS54161882A (en) | 1978-06-12 | 1978-06-12 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54161882A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62222642A (en) * | 1986-03-25 | 1987-09-30 | Toshiba Corp | Die bonding unit |
JPH0334443A (en) * | 1989-06-30 | 1991-02-14 | Toshiba Seiki Kk | Apparatus for stretching semiconductor wafer |
WO2007040032A1 (en) * | 2005-10-04 | 2007-04-12 | Lintec Corporation | Transfer device and transfer method |
JP2007142002A (en) * | 2005-11-16 | 2007-06-07 | Denso Corp | Semiconductor wafer pressing tool and usage thereof |
JP2014143313A (en) * | 2013-01-24 | 2014-08-07 | Disco Abrasive Syst Ltd | Extension device and extension method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0539997Y2 (en) * | 1989-11-17 | 1993-10-12 |
-
1978
- 1978-06-12 JP JP7136878A patent/JPS54161882A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62222642A (en) * | 1986-03-25 | 1987-09-30 | Toshiba Corp | Die bonding unit |
JPH07105404B2 (en) * | 1986-03-25 | 1995-11-13 | 株式会社東芝 | Die bonding machine |
JPH0334443A (en) * | 1989-06-30 | 1991-02-14 | Toshiba Seiki Kk | Apparatus for stretching semiconductor wafer |
WO2007040032A1 (en) * | 2005-10-04 | 2007-04-12 | Lintec Corporation | Transfer device and transfer method |
JP2007142002A (en) * | 2005-11-16 | 2007-06-07 | Denso Corp | Semiconductor wafer pressing tool and usage thereof |
JP4561605B2 (en) * | 2005-11-16 | 2010-10-13 | 株式会社デンソー | Semiconductor wafer pressing jig and method of using the same |
JP2014143313A (en) * | 2013-01-24 | 2014-08-07 | Disco Abrasive Syst Ltd | Extension device and extension method |
Also Published As
Publication number | Publication date |
---|---|
JPS5728949B2 (en) | 1982-06-19 |
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