JPS54161882A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS54161882A
JPS54161882A JP7136878A JP7136878A JPS54161882A JP S54161882 A JPS54161882 A JP S54161882A JP 7136878 A JP7136878 A JP 7136878A JP 7136878 A JP7136878 A JP 7136878A JP S54161882 A JPS54161882 A JP S54161882A
Authority
JP
Japan
Prior art keywords
expansion
sheet
ring
constitution
axle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7136878A
Other languages
Japanese (ja)
Other versions
JPS5728949B2 (en
Inventor
Yuzo Fujii
Masaaki Koga
Makoto Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP7136878A priority Critical patent/JPS54161882A/en
Publication of JPS54161882A publication Critical patent/JPS54161882A/en
Publication of JPS5728949B2 publication Critical patent/JPS5728949B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To obtain an accurate expansion state at all times by detecting the degree of expansion of the semiconductor substrate space caused by expansion of the heat expandable sheet at the utmost outer edge position of the substrate and then stopping the expansion.
CONSTITUTION: Heat expandable sheet 3 with semiconductor element 1 stuck is applied to fixture ring 7, and up-down movable ring 11 is provided to the lower side of sheet 3. When axle 9 is raised up after heating sheet 3, the space of element 1 is expanded by extension of sheet 3, and the element at the utmost outer edge moves above photo sensor 12 and 13 to cut off the light. At this moment the photoelectric signal disappears, the rising of axle 9 is stopped to end the expansion. After this, ring 14 is fitted to ring 11 to fix sheet 3. Ring 11 is detachable from support part 10. In such constitution, an accurate expansion state is secured at all times with elimination of the uneven expansion, and also the pickup can be prevented for the adjacent elements.
COPYRIGHT: (C)1979,JPO&Japio
JP7136878A 1978-06-12 1978-06-12 Manufacture of semiconductor device Granted JPS54161882A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7136878A JPS54161882A (en) 1978-06-12 1978-06-12 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7136878A JPS54161882A (en) 1978-06-12 1978-06-12 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS54161882A true JPS54161882A (en) 1979-12-21
JPS5728949B2 JPS5728949B2 (en) 1982-06-19

Family

ID=13458480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7136878A Granted JPS54161882A (en) 1978-06-12 1978-06-12 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54161882A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222642A (en) * 1986-03-25 1987-09-30 Toshiba Corp Die bonding unit
JPH0334443A (en) * 1989-06-30 1991-02-14 Toshiba Seiki Kk Apparatus for stretching semiconductor wafer
WO2007040032A1 (en) * 2005-10-04 2007-04-12 Lintec Corporation Transfer device and transfer method
JP2007142002A (en) * 2005-11-16 2007-06-07 Denso Corp Semiconductor wafer pressing tool and usage thereof
JP2014143313A (en) * 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd Extension device and extension method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539997Y2 (en) * 1989-11-17 1993-10-12

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222642A (en) * 1986-03-25 1987-09-30 Toshiba Corp Die bonding unit
JPH07105404B2 (en) * 1986-03-25 1995-11-13 株式会社東芝 Die bonding machine
JPH0334443A (en) * 1989-06-30 1991-02-14 Toshiba Seiki Kk Apparatus for stretching semiconductor wafer
WO2007040032A1 (en) * 2005-10-04 2007-04-12 Lintec Corporation Transfer device and transfer method
JP2007142002A (en) * 2005-11-16 2007-06-07 Denso Corp Semiconductor wafer pressing tool and usage thereof
JP4561605B2 (en) * 2005-11-16 2010-10-13 株式会社デンソー Semiconductor wafer pressing jig and method of using the same
JP2014143313A (en) * 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd Extension device and extension method

Also Published As

Publication number Publication date
JPS5728949B2 (en) 1982-06-19

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