JPS54160456A - Heat-curing epoxy resin composition partly curable with moisture - Google Patents

Heat-curing epoxy resin composition partly curable with moisture

Info

Publication number
JPS54160456A
JPS54160456A JP6835978A JP6835978A JPS54160456A JP S54160456 A JPS54160456 A JP S54160456A JP 6835978 A JP6835978 A JP 6835978A JP 6835978 A JP6835978 A JP 6835978A JP S54160456 A JPS54160456 A JP S54160456A
Authority
JP
Japan
Prior art keywords
curing
heat
epoxy
moisture
phosphite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6835978A
Other languages
Japanese (ja)
Inventor
Yasuo Takagi
Fujio Goto
Hidekazu Okuno
Haruyoshi Takagishi
Makoto Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEMEDAIN KK
Cemedine Co Ltd
Nissan Motor Co Ltd
Original Assignee
SEMEDAIN KK
Cemedine Co Ltd
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEMEDAIN KK, Cemedine Co Ltd, Nissan Motor Co Ltd filed Critical SEMEDAIN KK
Priority to JP6835978A priority Critical patent/JPS54160456A/en
Publication of JPS54160456A publication Critical patent/JPS54160456A/en
Pending legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: The title resin composition easily handleable till heat curing by forming cured films in contact with moisture before the curing, comprising a phosphite or phosphate and a curing agent for heat-curing epoxy resins.
CONSTITUTION: A liquid composition comprising (A) an epoxy compound having one or more epoxy groups in the molecule on the average, (B) a phosphite and/or a phosphate in an amount of 10W100% of the stoichiometric one based on the epoxy compound, and (C) a curing agent for heat-curing epoxy resins in an amount of 50W150% of the stoichiometric one based on the epoxy group. The phosphite or phosphate is hydrolyzed in contact with moisture to form phosphorous or phosphoric acid which cures the epoxy resin partly as a curing agent. The film formed by partial curing prevents the staining of other materials and inflammation in contact with the human skin during the handling till heat curing.
COPYRIGHT: (C)1979,JPO&Japio
JP6835978A 1978-06-08 1978-06-08 Heat-curing epoxy resin composition partly curable with moisture Pending JPS54160456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6835978A JPS54160456A (en) 1978-06-08 1978-06-08 Heat-curing epoxy resin composition partly curable with moisture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6835978A JPS54160456A (en) 1978-06-08 1978-06-08 Heat-curing epoxy resin composition partly curable with moisture

Publications (1)

Publication Number Publication Date
JPS54160456A true JPS54160456A (en) 1979-12-19

Family

ID=13371520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6835978A Pending JPS54160456A (en) 1978-06-08 1978-06-08 Heat-curing epoxy resin composition partly curable with moisture

Country Status (1)

Country Link
JP (1) JPS54160456A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147543A (en) * 1979-05-04 1980-11-17 Matsushita Electric Ind Co Ltd Epoxy resin powder composition
JPS6310619A (en) * 1986-06-23 1988-01-18 アツシユランド・オイル・インコ−ポレ−テツド Curable epoxide composition
US5331080A (en) * 1992-04-02 1994-07-19 Ppg Industries, Inc. Epoxide-phosphorous acid-containing reaction products and their use in coating compositions
JP2006124563A (en) * 2004-10-29 2006-05-18 Sunstar Engineering Inc Two-liquid sealer composition
JP2013523957A (en) * 2010-03-31 2013-06-17 スリーエム イノベイティブ プロパティズ カンパニー Epoxy adhesive composition containing curing accelerator

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147543A (en) * 1979-05-04 1980-11-17 Matsushita Electric Ind Co Ltd Epoxy resin powder composition
JPS6310619A (en) * 1986-06-23 1988-01-18 アツシユランド・オイル・インコ−ポレ−テツド Curable epoxide composition
US5331080A (en) * 1992-04-02 1994-07-19 Ppg Industries, Inc. Epoxide-phosphorous acid-containing reaction products and their use in coating compositions
JP2006124563A (en) * 2004-10-29 2006-05-18 Sunstar Engineering Inc Two-liquid sealer composition
JP4607544B2 (en) * 2004-10-29 2011-01-05 サンスター技研株式会社 Two-part sealer composition
JP2013523957A (en) * 2010-03-31 2013-06-17 スリーエム イノベイティブ プロパティズ カンパニー Epoxy adhesive composition containing curing accelerator
US10106711B2 (en) 2010-03-31 2018-10-23 3M Intellectual Property Company Epoxy adhesive compositions comprising an adhesion promoter

Similar Documents

Publication Publication Date Title
JPS54160456A (en) Heat-curing epoxy resin composition partly curable with moisture
BR8106910A (en) COMPOSITION COATING AGENT AND CURED COATING
JPS52139199A (en) Novel epoxy resin compositions
JPS5426000A (en) Epoxy resin composition
JPS54160454A (en) Heat-curing epoxy resin composition partly curable with air
SE8303157D0 (en) PROCEDURE FOR PREPARING THE OUTSIDE OF A SKI
JPS54160455A (en) Heat-curing epoxy resin composition partly curable with radiation
JPS51144453A (en) Preparation of polyamide resin chips
JPS544994A (en) Epoxy resin composition
JPS5454199A (en) Epoxy resin composition
JPS5740524A (en) Epoxy resin composition
JPS57137364A (en) Chipping-resistant coating resin composition
JPS5787471A (en) Thermosetting resin composition
JPS5749613A (en) Thermosetting resin composition
JPS57121042A (en) Resin composition
JPS5626917A (en) Low-smell resin composition
JPS52127927A (en) Thermosetting coating compositions
JPS5759947A (en) Curing of phenolic resin
JPS5647445A (en) Epoxy resin composition
JPS53104654A (en) Aromatic polyester copolymer composition
JPS56131620A (en) Epoxy resin composition
JPS5298100A (en) Curing of epoxy resins
JPS54160496A (en) Curable composition
JPS5334897A (en) Epoxy resin composition
JPS51125499A (en) A method for curing epoxy resins