JPS54160456A - Heat-curing epoxy resin composition partly curable with moisture - Google Patents
Heat-curing epoxy resin composition partly curable with moistureInfo
- Publication number
- JPS54160456A JPS54160456A JP6835978A JP6835978A JPS54160456A JP S54160456 A JPS54160456 A JP S54160456A JP 6835978 A JP6835978 A JP 6835978A JP 6835978 A JP6835978 A JP 6835978A JP S54160456 A JPS54160456 A JP S54160456A
- Authority
- JP
- Japan
- Prior art keywords
- curing
- heat
- epoxy
- moisture
- phosphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: The title resin composition easily handleable till heat curing by forming cured films in contact with moisture before the curing, comprising a phosphite or phosphate and a curing agent for heat-curing epoxy resins.
CONSTITUTION: A liquid composition comprising (A) an epoxy compound having one or more epoxy groups in the molecule on the average, (B) a phosphite and/or a phosphate in an amount of 10W100% of the stoichiometric one based on the epoxy compound, and (C) a curing agent for heat-curing epoxy resins in an amount of 50W150% of the stoichiometric one based on the epoxy group. The phosphite or phosphate is hydrolyzed in contact with moisture to form phosphorous or phosphoric acid which cures the epoxy resin partly as a curing agent. The film formed by partial curing prevents the staining of other materials and inflammation in contact with the human skin during the handling till heat curing.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6835978A JPS54160456A (en) | 1978-06-08 | 1978-06-08 | Heat-curing epoxy resin composition partly curable with moisture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6835978A JPS54160456A (en) | 1978-06-08 | 1978-06-08 | Heat-curing epoxy resin composition partly curable with moisture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54160456A true JPS54160456A (en) | 1979-12-19 |
Family
ID=13371520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6835978A Pending JPS54160456A (en) | 1978-06-08 | 1978-06-08 | Heat-curing epoxy resin composition partly curable with moisture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54160456A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55147543A (en) * | 1979-05-04 | 1980-11-17 | Matsushita Electric Ind Co Ltd | Epoxy resin powder composition |
JPS6310619A (en) * | 1986-06-23 | 1988-01-18 | アツシユランド・オイル・インコ−ポレ−テツド | Curable epoxide composition |
US5331080A (en) * | 1992-04-02 | 1994-07-19 | Ppg Industries, Inc. | Epoxide-phosphorous acid-containing reaction products and their use in coating compositions |
JP2006124563A (en) * | 2004-10-29 | 2006-05-18 | Sunstar Engineering Inc | Two-liquid sealer composition |
JP2013523957A (en) * | 2010-03-31 | 2013-06-17 | スリーエム イノベイティブ プロパティズ カンパニー | Epoxy adhesive composition containing curing accelerator |
-
1978
- 1978-06-08 JP JP6835978A patent/JPS54160456A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55147543A (en) * | 1979-05-04 | 1980-11-17 | Matsushita Electric Ind Co Ltd | Epoxy resin powder composition |
JPS6310619A (en) * | 1986-06-23 | 1988-01-18 | アツシユランド・オイル・インコ−ポレ−テツド | Curable epoxide composition |
US5331080A (en) * | 1992-04-02 | 1994-07-19 | Ppg Industries, Inc. | Epoxide-phosphorous acid-containing reaction products and their use in coating compositions |
JP2006124563A (en) * | 2004-10-29 | 2006-05-18 | Sunstar Engineering Inc | Two-liquid sealer composition |
JP4607544B2 (en) * | 2004-10-29 | 2011-01-05 | サンスター技研株式会社 | Two-part sealer composition |
JP2013523957A (en) * | 2010-03-31 | 2013-06-17 | スリーエム イノベイティブ プロパティズ カンパニー | Epoxy adhesive composition containing curing accelerator |
US10106711B2 (en) | 2010-03-31 | 2018-10-23 | 3M Intellectual Property Company | Epoxy adhesive compositions comprising an adhesion promoter |
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