JPS54155768A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS54155768A JPS54155768A JP6467178A JP6467178A JPS54155768A JP S54155768 A JPS54155768 A JP S54155768A JP 6467178 A JP6467178 A JP 6467178A JP 6467178 A JP6467178 A JP 6467178A JP S54155768 A JPS54155768 A JP S54155768A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- seam
- electrode
- welding process
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To attain complete sealing with no shift in position between a container part containing a semiconductor element and a cap part, by using both a spot- welding process and a seam-welding process at the time of the welding between the both.
CONSTITUTION: Inside of the concave part provided to alumina ceramic stem 2, semiconductor element 4 is fixed, external lead 1 is led out, and on stem surrounding element 4, alumina weld ring 5 is bonded. On it, sealing cap 7 of Kovar, 42 alloy, or nickel-plated iron is mounted via metallized layer 7; a spot electrode is pushed against the end part of cap 7 first and a current if flowed between the electrode and metallized layer 6 to form weld spots 12 at the four corners of cap 7 and ring 5. Then, the electrode is substituted by a seam weld electrode and the circumferences are seam-welded entirely in a normal method. Consequently, cap 7 never shifts in position during a seam welding process, so that the sealing will be complete.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6467178A JPS54155768A (en) | 1978-05-29 | 1978-05-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6467178A JPS54155768A (en) | 1978-05-29 | 1978-05-29 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54155768A true JPS54155768A (en) | 1979-12-08 |
Family
ID=13264869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6467178A Pending JPS54155768A (en) | 1978-05-29 | 1978-05-29 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54155768A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4551745A (en) * | 1981-09-30 | 1985-11-05 | Fujitsu Limited | Package for semiconductor device |
JPH0282556A (en) * | 1988-09-19 | 1990-03-23 | Toshiba Corp | Sealing of hybrid ic |
CN103056500A (en) * | 2012-11-30 | 2013-04-24 | 北京时代民芯科技有限公司 | Welding method for semiconductor ceramic shell sealing cap |
-
1978
- 1978-05-29 JP JP6467178A patent/JPS54155768A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4551745A (en) * | 1981-09-30 | 1985-11-05 | Fujitsu Limited | Package for semiconductor device |
JPH0282556A (en) * | 1988-09-19 | 1990-03-23 | Toshiba Corp | Sealing of hybrid ic |
CN103056500A (en) * | 2012-11-30 | 2013-04-24 | 北京时代民芯科技有限公司 | Welding method for semiconductor ceramic shell sealing cap |
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