JPS54153745A - Method and apparatus for laser processing - Google Patents

Method and apparatus for laser processing

Info

Publication number
JPS54153745A
JPS54153745A JP6266578A JP6266578A JPS54153745A JP S54153745 A JPS54153745 A JP S54153745A JP 6266578 A JP6266578 A JP 6266578A JP 6266578 A JP6266578 A JP 6266578A JP S54153745 A JPS54153745 A JP S54153745A
Authority
JP
Japan
Prior art keywords
processing
welding
cutting
half mirror
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6266578A
Other languages
Japanese (ja)
Inventor
Akihiro Takaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6266578A priority Critical patent/JPS54153745A/en
Publication of JPS54153745A publication Critical patent/JPS54153745A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/085—Tubes, rods or hollow products
    • C03B33/0855—Tubes, rods or hollow products using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

PURPOSE:To process a brittle material with good efficiency by performing concurrently a heat treatment using laser and a processing treatment, e.g., cutting, welding, etc., on a material to be processed. CONSTITUTION:The laser beam 2 emitted from the laser oscillator 1 is split by the beam splitter 4 consisting of a half mirror, and then the laser beam reflected and bent downward vertically by the half mirror is regulated to an energy density suitable for preheating by the lens 8. The laser beam which permeated through the half mirror is bent downward vertically by the beam bender 3 consisting of a total reflection mirror and then focused into a small spot of a high energy density suitable for processing using the lens 7. When a material to be processed is sent in the processing progressive direction 10, preheating and cutting or welding are concurrently conducted. Or, when the processing progressive direction is inversed, a processing- postheating treatment is made possible. The method is applicable to the cutting of brittle materials, e.g., glass, etc., and also to the welding of high-carbon steel materials or the like.
JP6266578A 1978-05-24 1978-05-24 Method and apparatus for laser processing Pending JPS54153745A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6266578A JPS54153745A (en) 1978-05-24 1978-05-24 Method and apparatus for laser processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6266578A JPS54153745A (en) 1978-05-24 1978-05-24 Method and apparatus for laser processing

Publications (1)

Publication Number Publication Date
JPS54153745A true JPS54153745A (en) 1979-12-04

Family

ID=13206807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6266578A Pending JPS54153745A (en) 1978-05-24 1978-05-24 Method and apparatus for laser processing

Country Status (1)

Country Link
JP (1) JPS54153745A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146386A (en) * 1984-08-09 1986-03-06 Mitsubishi Electric Corp Welding device
JPS61263296A (en) * 1985-05-17 1986-11-21 株式会社日立製作所 Terminal connection method and apparatus
JPH02295686A (en) * 1989-05-08 1990-12-06 Amada Co Ltd Laser beam welding method and laser beam machining head used for the method
JPH07323385A (en) * 1994-06-02 1995-12-12 Souei Tsusho Kk Method for cutting brittle material
JP2000301376A (en) * 1999-04-05 2000-10-31 General Electric Co <Ge> Heat treatment of weld bead
US6361867B2 (en) 1996-03-19 2002-03-26 Fujitsu Limited Laminated glass substrate structure and its manufacture
KR100347956B1 (en) * 1999-12-29 2002-08-09 엘지전자주식회사 A apparatus for cut-off of glass by laser beam
WO2004038775A1 (en) * 2002-10-22 2004-05-06 Samsung Electronics Co., Ltd. Method of polycyrstallization, method of manufacturing polysilicon thin film transistor, and laser irradiation device therefor
WO2009051164A1 (en) * 2007-10-16 2009-04-23 Kabushiki Kaisha Toshiba Method for sealing cracks on surface
WO2010048733A1 (en) * 2008-10-29 2010-05-06 Oerlikon Solar Ip Ag, Trübbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
EP2186594A1 (en) * 2008-11-12 2010-05-19 Siemens Aktiengesellschaft Method of and device for pre-heating during welding using a second laser beam
JP2010207839A (en) * 2009-03-09 2010-09-24 Nissan Motor Co Ltd Laser beam welding equipment and laser beam welding method
WO2010123068A1 (en) * 2009-04-22 2010-10-28 古河電気工業株式会社 Laser processing device and method of laser processing
EP2444194A1 (en) * 2010-10-23 2012-04-25 Rolls-Royce plc Method for beam welding on components
CN106583726A (en) * 2017-01-24 2017-04-26 苏州大学 Multi-beam laser cladding device
US9662733B2 (en) 2007-08-03 2017-05-30 Baker Hughes Incorporated Methods for reparing particle-matrix composite bodies
CN111058029A (en) * 2019-12-20 2020-04-24 东南大学 Laser cladding head capable of simultaneously performing preheating tempering and laser cladding method thereof

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146386A (en) * 1984-08-09 1986-03-06 Mitsubishi Electric Corp Welding device
JPS61263296A (en) * 1985-05-17 1986-11-21 株式会社日立製作所 Terminal connection method and apparatus
JPH0744332B2 (en) * 1985-05-17 1995-05-15 株式会社日立製作所 Terminal connection method and device
JPH02295686A (en) * 1989-05-08 1990-12-06 Amada Co Ltd Laser beam welding method and laser beam machining head used for the method
JPH07323385A (en) * 1994-06-02 1995-12-12 Souei Tsusho Kk Method for cutting brittle material
US6361867B2 (en) 1996-03-19 2002-03-26 Fujitsu Limited Laminated glass substrate structure and its manufacture
JP2000301376A (en) * 1999-04-05 2000-10-31 General Electric Co <Ge> Heat treatment of weld bead
KR100347956B1 (en) * 1999-12-29 2002-08-09 엘지전자주식회사 A apparatus for cut-off of glass by laser beam
WO2004038775A1 (en) * 2002-10-22 2004-05-06 Samsung Electronics Co., Ltd. Method of polycyrstallization, method of manufacturing polysilicon thin film transistor, and laser irradiation device therefor
CN100364053C (en) * 2002-10-22 2008-01-23 三星电子株式会社 Method of polycyrstallization, method of manufacturing polysilicon thin film transistor, and laser irradiation device therefor
US11370049B2 (en) 2007-08-03 2022-06-28 Baker Hughes Holdings Llc Earth-boring tools having particle-matrix composite bodies and methods for welding particle-matrix composite bodies
US10493550B2 (en) 2007-08-03 2019-12-03 Baker Hughes, A Ge Company, Llc Earth-boring tools having particle-matrix composite bodies and methods for welding particle-matrix composite bodies
US9662733B2 (en) 2007-08-03 2017-05-30 Baker Hughes Incorporated Methods for reparing particle-matrix composite bodies
US8378256B2 (en) 2007-10-16 2013-02-19 Kabushiki Kaisha Toshiba Surface crack sealing method
KR101226998B1 (en) * 2007-10-16 2013-01-28 가부시끼가이샤 도시바 Method for sealing cracks on surface
JP2009095851A (en) * 2007-10-16 2009-05-07 Toshiba Corp Method for sealing surface crack
WO2009051164A1 (en) * 2007-10-16 2009-04-23 Kabushiki Kaisha Toshiba Method for sealing cracks on surface
WO2010048733A1 (en) * 2008-10-29 2010-05-06 Oerlikon Solar Ip Ag, Trübbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
EP2186594A1 (en) * 2008-11-12 2010-05-19 Siemens Aktiengesellschaft Method of and device for pre-heating during welding using a second laser beam
JP2010207839A (en) * 2009-03-09 2010-09-24 Nissan Motor Co Ltd Laser beam welding equipment and laser beam welding method
WO2010123068A1 (en) * 2009-04-22 2010-10-28 古河電気工業株式会社 Laser processing device and method of laser processing
EP2444194A1 (en) * 2010-10-23 2012-04-25 Rolls-Royce plc Method for beam welding on components
US8813360B2 (en) 2010-10-23 2014-08-26 Rolls-Royce Plc Method for beam welding on components
CN106583726A (en) * 2017-01-24 2017-04-26 苏州大学 Multi-beam laser cladding device
CN106583726B (en) * 2017-01-24 2018-10-16 苏州大学 Laser multiple beam cladding apparatus
CN111058029A (en) * 2019-12-20 2020-04-24 东南大学 Laser cladding head capable of simultaneously performing preheating tempering and laser cladding method thereof

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