JPS54142065A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54142065A JPS54142065A JP5086078A JP5086078A JPS54142065A JP S54142065 A JPS54142065 A JP S54142065A JP 5086078 A JP5086078 A JP 5086078A JP 5086078 A JP5086078 A JP 5086078A JP S54142065 A JPS54142065 A JP S54142065A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- print substrate
- adhesive
- outer frame
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To increase the working efficiency by applying the adhesive to part of the outer frame of the semiconductor device.
CONSTITUTION: Adhesive 2 is sticked on the back of outer frame 1 of the semiconductor device, and the device is fixed temporarily to print substrate 5. Then external lead 3 is positioned to wiring layer 4. Under these conditions, the device is made to pass through the solder soaking tank. Thus, the wiring layer is soldered to the external lead, and at the same time the semiconductor device is fixed permanently to the print substrate. With this method, the adhesive coating is omitted in the process under which the semiconductor device is fixed temporarily to the print substrate. Thus, the device insertion can be simplified, increasing the working efficiency.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5086078A JPS54142065A (en) | 1978-04-27 | 1978-04-27 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5086078A JPS54142065A (en) | 1978-04-27 | 1978-04-27 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54142065A true JPS54142065A (en) | 1979-11-05 |
Family
ID=12870467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5086078A Pending JPS54142065A (en) | 1978-04-27 | 1978-04-27 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54142065A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017511609A (en) * | 2014-04-18 | 2017-04-20 | レイセオン カンパニー | Method for aligning surface mount packages for thermal improvement |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS496462A (en) * | 1972-05-10 | 1974-01-21 |
-
1978
- 1978-04-27 JP JP5086078A patent/JPS54142065A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS496462A (en) * | 1972-05-10 | 1974-01-21 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017511609A (en) * | 2014-04-18 | 2017-04-20 | レイセオン カンパニー | Method for aligning surface mount packages for thermal improvement |
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