JPS54122870A - Thick film circuit board - Google Patents
Thick film circuit boardInfo
- Publication number
- JPS54122870A JPS54122870A JP3072078A JP3072078A JPS54122870A JP S54122870 A JPS54122870 A JP S54122870A JP 3072078 A JP3072078 A JP 3072078A JP 3072078 A JP3072078 A JP 3072078A JP S54122870 A JPS54122870 A JP S54122870A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- thick film
- film circuit
- thick
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3072078A JPS54122870A (en) | 1978-03-17 | 1978-03-17 | Thick film circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3072078A JPS54122870A (en) | 1978-03-17 | 1978-03-17 | Thick film circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54122870A true JPS54122870A (en) | 1979-09-22 |
Family
ID=12311471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3072078A Pending JPS54122870A (en) | 1978-03-17 | 1978-03-17 | Thick film circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54122870A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6020146U (en) * | 1983-07-20 | 1985-02-12 | 日本電気株式会社 | Hybrid integrated circuit device |
JPS6142193A (en) * | 1984-08-02 | 1986-02-28 | 株式会社 麗光 | Printed circuit and transfer material for producing same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49128265A (en) * | 1973-04-12 | 1974-12-09 | ||
JPS5288766A (en) * | 1976-05-28 | 1977-07-25 | Hitachi Ltd | Method of forming bonding pad |
-
1978
- 1978-03-17 JP JP3072078A patent/JPS54122870A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49128265A (en) * | 1973-04-12 | 1974-12-09 | ||
JPS5288766A (en) * | 1976-05-28 | 1977-07-25 | Hitachi Ltd | Method of forming bonding pad |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6020146U (en) * | 1983-07-20 | 1985-02-12 | 日本電気株式会社 | Hybrid integrated circuit device |
JPS6334277Y2 (en) * | 1983-07-20 | 1988-09-12 | ||
JPS6142193A (en) * | 1984-08-02 | 1986-02-28 | 株式会社 麗光 | Printed circuit and transfer material for producing same |
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