JPS539950B2 - - Google Patents

Info

Publication number: JPS539950B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP4104174A

Other languages

Japanese (ja)

Other versions

JPS50134763A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-04-15

Filing date

1974-04-15

Publication date

1978-04-10

1974-04-15 Application filed filed Critical

1974-04-15 Priority to JP4104174A priority Critical patent/JPS539950B2/ja

1975-10-25 Publication of JPS50134763A publication Critical patent/JPS50134763A/ja

1978-04-10 Publication of JPS539950B2 publication Critical patent/JPS539950B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Pressure Welding/Diffusion-Bonding (AREA)
Wire Bonding (AREA)
Motor Or Generator Current Collectors (AREA)

JP4104174A 1974-04-15 1974-04-15 Expired JPS539950B2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP4104174A JPS539950B2 (en)	1974-04-15	1974-04-15

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP4104174A JPS539950B2 (en)	1974-04-15	1974-04-15

Publications (2)

Publication Number	Publication Date
JPS50134763A JPS50134763A (en)	1975-10-25
JPS539950B2 true JPS539950B2 (en)	1978-04-10

Family

ID=12597306

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4104174A Expired JPS539950B2 (en)	1974-04-15	1974-04-15

Country Status (1)

Country	Link
JP (1)	JPS539950B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS55144752A (en) *	1979-04-27	1980-11-11	Mitsubishi Electric Corp	Connecting method for armature coil for rotary machine
JPS55147953A (en) *	1979-05-07	1980-11-18	Mitsubishi Electric Corp	Connecting method of armature coil
JPS61166035A (en) *	1985-12-09	1986-07-26	Hitachi Ltd	Wire bonding method

1974
- 1974-04-15 JP JP4104174A patent/JPS539950B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS50134763A (en)	1975-10-25

Publication	Publication Date	Title
JPS50123304A (en)	1975-09-27
JPS50114391A (en)	1975-09-08
FR2283018B1 (en)	1978-04-07
JPS50127103A (en)	1975-10-06
FR2278961B1 (en)	1979-05-11
JPS50120836A (en)	1975-09-22
FR2276991B1 (en)	1982-04-23
FR2287078B1 (en)	1978-04-07
FR2291579B3 (en)	1978-08-18
JPS539950B2 (en)	1978-04-10
FR2267197A1 (en)	1975-11-07
JPS50124776A (en)	1975-10-01
AR198466A1 (en)	1974-06-21
JPS5417346Y2 (en)	1979-07-04
JPS50117489U (en)	1975-09-25
JPS50111878A (en)	1975-09-02
BR5408676U (en)	1976-07-13
CS172765B1 (en)	1977-01-28
JPS50104407U (en)	1975-08-28
CH573583A5 (en)	1976-03-15
CH571903A5 (en)	1976-01-30
CH569961A5 (en)	1975-11-28
CH571077A5 (en)	1975-12-31
CH568672A5 (en)	1975-10-31
CH562552A5 (en)	1975-06-13