JPS5387171A - Glass sealed semiconductor device - Google Patents

Glass sealed semiconductor device

Info

Publication number
JPS5387171A
JPS5387171A JP148077A JP148077A JPS5387171A JP S5387171 A JPS5387171 A JP S5387171A JP 148077 A JP148077 A JP 148077A JP 148077 A JP148077 A JP 148077A JP S5387171 A JPS5387171 A JP S5387171A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealed semiconductor
glass sealed
glass
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP148077A
Other languages
Japanese (ja)
Inventor
Hiroshi Momona
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP148077A priority Critical patent/JPS5387171A/en
Publication of JPS5387171A publication Critical patent/JPS5387171A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain a glass sealed semiconductor device of a small outside dimension in relation to the packaging density of pellets.
COPYRIGHT: (C)1978,JPO&Japio
JP148077A 1977-01-12 1977-01-12 Glass sealed semiconductor device Pending JPS5387171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP148077A JPS5387171A (en) 1977-01-12 1977-01-12 Glass sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP148077A JPS5387171A (en) 1977-01-12 1977-01-12 Glass sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5387171A true JPS5387171A (en) 1978-08-01

Family

ID=11502595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP148077A Pending JPS5387171A (en) 1977-01-12 1977-01-12 Glass sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5387171A (en)

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