JPS5387166A - Electronic part bonding tool and its production - Google Patents
Electronic part bonding tool and its productionInfo
- Publication number
- JPS5387166A JPS5387166A JP205877A JP205877A JPS5387166A JP S5387166 A JPS5387166 A JP S5387166A JP 205877 A JP205877 A JP 205877A JP 205877 A JP205877 A JP 205877A JP S5387166 A JPS5387166 A JP S5387166A
- Authority
- JP
- Japan
- Prior art keywords
- production
- electronic part
- bonding tool
- part bonding
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To drastically prolong the life of the tool and facilitate its maintenance by forming the bonding face of the tool by a hard material differing from that of the body.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP205877A JPS5387166A (en) | 1977-01-11 | 1977-01-11 | Electronic part bonding tool and its production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP205877A JPS5387166A (en) | 1977-01-11 | 1977-01-11 | Electronic part bonding tool and its production |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5387166A true JPS5387166A (en) | 1978-08-01 |
Family
ID=11518727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP205877A Pending JPS5387166A (en) | 1977-01-11 | 1977-01-11 | Electronic part bonding tool and its production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5387166A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09115969A (en) * | 1995-10-16 | 1997-05-02 | Nec Corp | Bonding tool |
US7389905B2 (en) * | 1999-02-25 | 2008-06-24 | Reiber Steven F | Flip chip bonding tool tip |
-
1977
- 1977-01-11 JP JP205877A patent/JPS5387166A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09115969A (en) * | 1995-10-16 | 1997-05-02 | Nec Corp | Bonding tool |
US7389905B2 (en) * | 1999-02-25 | 2008-06-24 | Reiber Steven F | Flip chip bonding tool tip |
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