JPS5384688A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5384688A JPS5384688A JP15938976A JP15938976A JPS5384688A JP S5384688 A JPS5384688 A JP S5384688A JP 15938976 A JP15938976 A JP 15938976A JP 15938976 A JP15938976 A JP 15938976A JP S5384688 A JPS5384688 A JP S5384688A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- production
- impurity
- doping
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000012535 impurity Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To produce a semiconductor device of high dielectric strength by forming a base region through doping of an impurity, then forming an emitter region through doping of an impurity of conductivity type opposite from that of said impurity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15938976A JPS5384688A (en) | 1976-12-30 | 1976-12-30 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15938976A JPS5384688A (en) | 1976-12-30 | 1976-12-30 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5384688A true JPS5384688A (en) | 1978-07-26 |
Family
ID=15692709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15938976A Pending JPS5384688A (en) | 1976-12-30 | 1976-12-30 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5384688A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6110274A (en) * | 1984-06-25 | 1986-01-17 | Rohm Co Ltd | Semiconductor device and manufacture thereof |
JPS6320825A (en) * | 1986-07-14 | 1988-01-28 | Mitsubishi Electric Corp | Diffusion method for semiconductor device |
-
1976
- 1976-12-30 JP JP15938976A patent/JPS5384688A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6110274A (en) * | 1984-06-25 | 1986-01-17 | Rohm Co Ltd | Semiconductor device and manufacture thereof |
JPS6320825A (en) * | 1986-07-14 | 1988-01-28 | Mitsubishi Electric Corp | Diffusion method for semiconductor device |
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