JPS5368571A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5368571A
JPS5368571A JP14435276A JP14435276A JPS5368571A JP S5368571 A JPS5368571 A JP S5368571A JP 14435276 A JP14435276 A JP 14435276A JP 14435276 A JP14435276 A JP 14435276A JP S5368571 A JPS5368571 A JP S5368571A
Authority
JP
Japan
Prior art keywords
solder
production
semiconductor device
base plate
mouting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14435276A
Other languages
Japanese (ja)
Inventor
Yoichi Ushiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP14435276A priority Critical patent/JPS5368571A/en
Publication of JPS5368571A publication Critical patent/JPS5368571A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To make the mouting strength of an element to a base plate firm and improve radiation effect by depositing preliminary solder on the back of the semiconductor element mounting the element to a metal base plate through heating and fusing the solder and refusing the solder in a vacuum after the solder has cooled and solidified.
COPYRIGHT: (C)1978,JPO&Japio
JP14435276A 1976-11-30 1976-11-30 Production of semiconductor device Pending JPS5368571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14435276A JPS5368571A (en) 1976-11-30 1976-11-30 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14435276A JPS5368571A (en) 1976-11-30 1976-11-30 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5368571A true JPS5368571A (en) 1978-06-19

Family

ID=15360097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14435276A Pending JPS5368571A (en) 1976-11-30 1976-11-30 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5368571A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6985504B2 (en) 2002-02-19 2006-01-10 Matsushita Electric Industrial Co., Ltd. Semiconductor laser and method for manufacturing the same
JP2008277757A (en) * 2007-03-06 2008-11-13 Infineon Technologies Ag Solder connection section between semiconductor chip and substrate, and manufacturing process for the same
JP2017103404A (en) * 2015-12-04 2017-06-08 シャープ株式会社 Semiconductor device and manufacturing method of the same
JP2020064937A (en) * 2018-10-16 2020-04-23 トヨタ自動車株式会社 Method of manufacturing semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS461974A (en) * 1970-02-06 1974-10-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS461974A (en) * 1970-02-06 1974-10-07

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6985504B2 (en) 2002-02-19 2006-01-10 Matsushita Electric Industrial Co., Ltd. Semiconductor laser and method for manufacturing the same
US7142576B2 (en) 2002-02-19 2006-11-28 Matsushita Electric Industrial Co., Ltd. Semiconductor laser
JP2008277757A (en) * 2007-03-06 2008-11-13 Infineon Technologies Ag Solder connection section between semiconductor chip and substrate, and manufacturing process for the same
JP2017103404A (en) * 2015-12-04 2017-06-08 シャープ株式会社 Semiconductor device and manufacturing method of the same
JP2020064937A (en) * 2018-10-16 2020-04-23 トヨタ自動車株式会社 Method of manufacturing semiconductor device

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