JPS5366565A - Method of sealing electronic parts - Google Patents

Method of sealing electronic parts

Info

Publication number
JPS5366565A
JPS5366565A JP14132076A JP14132076A JPS5366565A JP S5366565 A JPS5366565 A JP S5366565A JP 14132076 A JP14132076 A JP 14132076A JP 14132076 A JP14132076 A JP 14132076A JP S5366565 A JPS5366565 A JP S5366565A
Authority
JP
Japan
Prior art keywords
electronic parts
sealing electronic
sealing
parts
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14132076A
Other languages
Japanese (ja)
Other versions
JPS562790B2 (en
Inventor
Shigeyuki Narisawa
Hiroshi Yanase
Michihiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP14132076A priority Critical patent/JPS5366565A/en
Publication of JPS5366565A publication Critical patent/JPS5366565A/en
Publication of JPS562790B2 publication Critical patent/JPS562790B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
JP14132076A 1976-11-26 1976-11-26 Method of sealing electronic parts Granted JPS5366565A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14132076A JPS5366565A (en) 1976-11-26 1976-11-26 Method of sealing electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14132076A JPS5366565A (en) 1976-11-26 1976-11-26 Method of sealing electronic parts

Publications (2)

Publication Number Publication Date
JPS5366565A true JPS5366565A (en) 1978-06-14
JPS562790B2 JPS562790B2 (en) 1981-01-21

Family

ID=15289163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14132076A Granted JPS5366565A (en) 1976-11-26 1976-11-26 Method of sealing electronic parts

Country Status (1)

Country Link
JP (1) JPS5366565A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5583206A (en) * 1978-12-19 1980-06-23 Hofsass P Method of coating component by insulator and component coated thereby
JPS56102004A (en) * 1979-12-27 1981-08-15 Union Carbide Corp Use of organic titanate for packaging electric component
JPS56135549A (en) * 1980-03-26 1981-10-23 Dainippon Ink & Chem Inc Polyarylene sulfide resin composition
JPS56169313A (en) * 1980-04-24 1981-12-26 Int Standard Electric Corp Method of covering electric part with synthetic resin
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS5770157A (en) * 1980-10-21 1982-04-30 Dainippon Ink & Chem Inc Glass fiber-reinforced polyarylane sulfide resin composition
JPS57168945A (en) * 1981-04-13 1982-10-18 Dainippon Ink & Chem Inc Resin composition
JPS5827326A (en) * 1981-08-11 1983-02-18 Japan Steel Works Ltd:The Resin sealing method of ic chips
JPS5852831A (en) * 1981-09-24 1983-03-29 Japan Steel Works Ltd:The Resin sealing of semiconductor
JPS6254401A (en) * 1985-09-02 1987-03-10 株式会社村田製作所 Electronic component
US4956499A (en) * 1987-03-30 1990-09-11 Kureha Kagaku Kogyo Kabushiki Kaisha Polyarylene thioether composition for molding
JPH02237139A (en) * 1989-03-10 1990-09-19 Kureha Chem Ind Co Ltd Electronic-component sealed and molded body

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB618094A (en) * 1945-10-19 1949-02-16 Du Pont Plastic compositions containing glass fibres
US3929708A (en) * 1974-08-15 1975-12-30 Phillips Petroleum Co Arylene sulfide polymers comprising silicone fluids
JPS517705A (en) * 1974-06-20 1976-01-22 Kubota Ltd KUTSUSAKUKI
JPS5112861A (en) * 1974-07-24 1976-01-31 Mitsui Petrochemical Ind HORIARIIRENSURUFUIDOJUSHISOSEIBUTSU
JPS569014A (en) * 1979-03-07 1981-01-29 Vni I Pk I Metarurugiichiesuko Nonnslip type multiple stream line material rolling mill

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB618094A (en) * 1945-10-19 1949-02-16 Du Pont Plastic compositions containing glass fibres
JPS517705A (en) * 1974-06-20 1976-01-22 Kubota Ltd KUTSUSAKUKI
JPS5112861A (en) * 1974-07-24 1976-01-31 Mitsui Petrochemical Ind HORIARIIRENSURUFUIDOJUSHISOSEIBUTSU
US3929708A (en) * 1974-08-15 1975-12-30 Phillips Petroleum Co Arylene sulfide polymers comprising silicone fluids
JPS569014A (en) * 1979-03-07 1981-01-29 Vni I Pk I Metarurugiichiesuko Nonnslip type multiple stream line material rolling mill

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6338651B2 (en) * 1978-12-19 1988-08-01 Hofsass P
JPS5583206A (en) * 1978-12-19 1980-06-23 Hofsass P Method of coating component by insulator and component coated thereby
JPS6137722B2 (en) * 1979-12-27 1986-08-26 Union Carbide Corp
JPS56102004A (en) * 1979-12-27 1981-08-15 Union Carbide Corp Use of organic titanate for packaging electric component
JPS56135549A (en) * 1980-03-26 1981-10-23 Dainippon Ink & Chem Inc Polyarylene sulfide resin composition
JPS6363590B2 (en) * 1980-03-26 1988-12-07
JPS56169313A (en) * 1980-04-24 1981-12-26 Int Standard Electric Corp Method of covering electric part with synthetic resin
JPS6311780B2 (en) * 1980-07-04 1988-03-16 Asahi Glass Co Ltd
EP0044136B1 (en) * 1980-07-04 1985-01-23 Asahi Glass Company Ltd. Encapsulation of electronic device
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS5770157A (en) * 1980-10-21 1982-04-30 Dainippon Ink & Chem Inc Glass fiber-reinforced polyarylane sulfide resin composition
JPS6363591B2 (en) * 1980-10-21 1988-12-07
JPS57168945A (en) * 1981-04-13 1982-10-18 Dainippon Ink & Chem Inc Resin composition
JPS5827326A (en) * 1981-08-11 1983-02-18 Japan Steel Works Ltd:The Resin sealing method of ic chips
JPS5852831A (en) * 1981-09-24 1983-03-29 Japan Steel Works Ltd:The Resin sealing of semiconductor
JPS6254401A (en) * 1985-09-02 1987-03-10 株式会社村田製作所 Electronic component
JPH0564841B2 (en) * 1985-09-02 1993-09-16 Murata Manufacturing Co
US4956499A (en) * 1987-03-30 1990-09-11 Kureha Kagaku Kogyo Kabushiki Kaisha Polyarylene thioether composition for molding
JPH02237139A (en) * 1989-03-10 1990-09-19 Kureha Chem Ind Co Ltd Electronic-component sealed and molded body

Also Published As

Publication number Publication date
JPS562790B2 (en) 1981-01-21

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