JPS5362699U - - Google Patents
Info
- Publication number
- JPS5362699U JPS5362699U JP14667776U JP14667776U JPS5362699U JP S5362699 U JPS5362699 U JP S5362699U JP 14667776 U JP14667776 U JP 14667776U JP 14667776 U JP14667776 U JP 14667776U JP S5362699 U JPS5362699 U JP S5362699U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14667776U JPS5362699U (en) | 1976-10-29 | 1976-10-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14667776U JPS5362699U (en) | 1976-10-29 | 1976-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5362699U true JPS5362699U (en) | 1978-05-27 |
Family
ID=28755155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14667776U Pending JPS5362699U (en) | 1976-10-29 | 1976-10-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5362699U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61276U (en) * | 1984-06-06 | 1986-01-06 | 三菱自動車工業株式会社 | Hole structure for lead wire for injector connection |
JP2017055133A (en) * | 2016-11-17 | 2017-03-16 | シャープ株式会社 | Electronic apparatus |
JP2018029190A (en) * | 2017-09-15 | 2018-02-22 | シャープ株式会社 | Electronic device |
-
1976
- 1976-10-29 JP JP14667776U patent/JPS5362699U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61276U (en) * | 1984-06-06 | 1986-01-06 | 三菱自動車工業株式会社 | Hole structure for lead wire for injector connection |
JP2017055133A (en) * | 2016-11-17 | 2017-03-16 | シャープ株式会社 | Electronic apparatus |
JP2018029190A (en) * | 2017-09-15 | 2018-02-22 | シャープ株式会社 | Electronic device |