JPS5334187A - Method of cutting semiconductor - Google Patents

Method of cutting semiconductor

Info

Publication number
JPS5334187A
JPS5334187A JP10955076A JP10955076A JPS5334187A JP S5334187 A JPS5334187 A JP S5334187A JP 10955076 A JP10955076 A JP 10955076A JP 10955076 A JP10955076 A JP 10955076A JP S5334187 A JPS5334187 A JP S5334187A
Authority
JP
Japan
Prior art keywords
cutting semiconductor
semiconductor crystal
distortions
cut
high speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10955076A
Other languages
Japanese (ja)
Other versions
JPS542703B2 (en
Inventor
Hiroshi Nakada
Shojiro Miyake
Junji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP10955076A priority Critical patent/JPS5334187A/en
Publication of JPS5334187A publication Critical patent/JPS5334187A/en
Publication of JPS542703B2 publication Critical patent/JPS542703B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To cut off a semiconductor crystal rotating at a high speed with a cutting edge of a thin wire or a thin band plate with grinding grains deposited thereon, in the direction perpendicular to an axis of the semiconductor crystal without accompanying distortions.
JP10955076A 1976-09-13 1976-09-13 Method of cutting semiconductor Granted JPS5334187A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10955076A JPS5334187A (en) 1976-09-13 1976-09-13 Method of cutting semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10955076A JPS5334187A (en) 1976-09-13 1976-09-13 Method of cutting semiconductor

Publications (2)

Publication Number Publication Date
JPS5334187A true JPS5334187A (en) 1978-03-30
JPS542703B2 JPS542703B2 (en) 1979-02-10

Family

ID=14513074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10955076A Granted JPS5334187A (en) 1976-09-13 1976-09-13 Method of cutting semiconductor

Country Status (1)

Country Link
JP (1) JPS5334187A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5569410A (en) * 1978-11-20 1980-05-26 Nippon Telegraph & Telephone Cutter
JPS5584617A (en) * 1978-12-22 1980-06-26 Nippon Telegraph & Telephone Very accurate cuttinggoff device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1366278A (en) * 1972-04-26 1974-09-11 Keller & Co Masch C Apparatus for cutting plastic material

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1366278A (en) * 1972-04-26 1974-09-11 Keller & Co Masch C Apparatus for cutting plastic material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5569410A (en) * 1978-11-20 1980-05-26 Nippon Telegraph & Telephone Cutter
JPS5584617A (en) * 1978-12-22 1980-06-26 Nippon Telegraph & Telephone Very accurate cuttinggoff device

Also Published As

Publication number Publication date
JPS542703B2 (en) 1979-02-10

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