JPS5333059A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5333059A
JPS5333059A JP10815376A JP10815376A JPS5333059A JP S5333059 A JPS5333059 A JP S5333059A JP 10815376 A JP10815376 A JP 10815376A JP 10815376 A JP10815376 A JP 10815376A JP S5333059 A JPS5333059 A JP S5333059A
Authority
JP
Japan
Prior art keywords
metal
semiconductor device
expausion
mearly
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10815376A
Other languages
Japanese (ja)
Inventor
Shuichi Osaka
Takashi Kondo
Masanobu Obara
Miyoshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10815376A priority Critical patent/JPS5333059A/en
Publication of JPS5333059A publication Critical patent/JPS5333059A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To make supporting electrodes by fixing bundles of fire wires of metal having excellent heat and electric conductivity by means of metal of coefficient of thermal expausion mearly equal to or smaller that of a semiconductor substrate.
JP10815376A 1976-09-08 1976-09-08 Semiconductor device Pending JPS5333059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10815376A JPS5333059A (en) 1976-09-08 1976-09-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10815376A JPS5333059A (en) 1976-09-08 1976-09-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5333059A true JPS5333059A (en) 1978-03-28

Family

ID=14477281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10815376A Pending JPS5333059A (en) 1976-09-08 1976-09-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5333059A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401728A (en) * 1980-03-27 1983-08-30 Asea Aktiebolag Composite material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401728A (en) * 1980-03-27 1983-08-30 Asea Aktiebolag Composite material

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