JPS5320194A - Method for polishing both surfaces undistortedly - Google Patents
Method for polishing both surfaces undistortedlyInfo
- Publication number
- JPS5320194A JPS5320194A JP9432776A JP9432776A JPS5320194A JP S5320194 A JPS5320194 A JP S5320194A JP 9432776 A JP9432776 A JP 9432776A JP 9432776 A JP9432776 A JP 9432776A JP S5320194 A JPS5320194 A JP S5320194A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- undistortedly
- single crystal
- crystal wafer
- polish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To polish both surfaces of a single crystal wafer undistortedly and rapidly by immersing the single crystal wafer in polishing liquid, and performing chemical and mechanical composite polishing on a polishing cloth.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9432776A JPS5320194A (en) | 1976-08-06 | 1976-08-06 | Method for polishing both surfaces undistortedly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9432776A JPS5320194A (en) | 1976-08-06 | 1976-08-06 | Method for polishing both surfaces undistortedly |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5320194A true JPS5320194A (en) | 1978-02-24 |
Family
ID=14107174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9432776A Pending JPS5320194A (en) | 1976-08-06 | 1976-08-06 | Method for polishing both surfaces undistortedly |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5320194A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5580881A (en) * | 1978-12-12 | 1980-06-18 | Nec Corp | Polishing method for single-crystal substrate |
JPH03221368A (en) * | 1989-11-10 | 1991-09-30 | Fujikoshi Kikai Kogyo Kk | Wafer machining device |
JPH04307935A (en) * | 1991-04-05 | 1992-10-30 | Fujikoshi Kikai Kogyo Kk | Double-side simultaneous grinding method of wafer and device thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5139497A (en) * | 1974-09-30 | 1976-04-02 | Hitachi Ltd |
-
1976
- 1976-08-06 JP JP9432776A patent/JPS5320194A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5139497A (en) * | 1974-09-30 | 1976-04-02 | Hitachi Ltd |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5580881A (en) * | 1978-12-12 | 1980-06-18 | Nec Corp | Polishing method for single-crystal substrate |
JPH03221368A (en) * | 1989-11-10 | 1991-09-30 | Fujikoshi Kikai Kogyo Kk | Wafer machining device |
JPH04307935A (en) * | 1991-04-05 | 1992-10-30 | Fujikoshi Kikai Kogyo Kk | Double-side simultaneous grinding method of wafer and device thereof |
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