JPS5315268Y2 - - Google Patents
Info
- Publication number
- JPS5315268Y2 JPS5315268Y2 JP4542072U JP4542072U JPS5315268Y2 JP S5315268 Y2 JPS5315268 Y2 JP S5315268Y2 JP 4542072 U JP4542072 U JP 4542072U JP 4542072 U JP4542072 U JP 4542072U JP S5315268 Y2 JPS5315268 Y2 JP S5315268Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4542072U JPS5315268Y2 (de) | 1972-04-17 | 1972-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4542072U JPS5315268Y2 (de) | 1972-04-17 | 1972-04-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS494573U JPS494573U (de) | 1974-01-16 |
| JPS5315268Y2 true JPS5315268Y2 (de) | 1978-04-21 |
Family
ID=27920857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4542072U Expired JPS5315268Y2 (de) | 1972-04-17 | 1972-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5315268Y2 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101085144B1 (ko) * | 2004-04-29 | 2011-11-21 | 엘지디스플레이 주식회사 | Ｌｅｄ 램프 유닛 |
-
1972
- 1972-04-17 JP JP4542072U patent/JPS5315268Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS494573U (de) | 1974-01-16 |