Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu LtdfiledCriticalFujitsu Ltd
Priority to JP5811177ApriorityCriticalpatent/JPS53142930A/en
Publication of JPS53142930ApublicationCriticalpatent/JPS53142930A/en
Solid-Phase Diffusion Into Metallic Material Surfaces
(AREA)
Abstract
PURPOSE: To maintain the good soldering and thermo press. bonding properties of electronic parts having pointscoated with a noble metal such as gold or platinum by plating, vacuum deposition or the like, by heat treating the parts at a low temp. in a vacuum or an inert gas atmosphere.
COPYRIGHT: (C)1978,JPO&Japio
JP5811177A1977-05-191977-05-19Low temperature heat treating method for electronic parts having noble metal coatings
PendingJPS53142930A
(en)