JPS53120761A - Polyamide resin composition - Google Patents

Polyamide resin composition

Info

Publication number
JPS53120761A
JPS53120761A JP3599577A JP3599577A JPS53120761A JP S53120761 A JPS53120761 A JP S53120761A JP 3599577 A JP3599577 A JP 3599577A JP 3599577 A JP3599577 A JP 3599577A JP S53120761 A JPS53120761 A JP S53120761A
Authority
JP
Japan
Prior art keywords
resin composition
polyamide resin
composition
incorporating
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3599577A
Other languages
Japanese (ja)
Other versions
JPS6057464B2 (en
Inventor
Akira Miyamoto
Katsuo Sato
Mitsuyasu Nagano
Kiyoshi Morishige
Kenichi Narita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP3599577A priority Critical patent/JPS6057464B2/en
Publication of JPS53120761A publication Critical patent/JPS53120761A/en
Publication of JPS6057464B2 publication Critical patent/JPS6057464B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: A composition having improved physical, thermal, chemical properties and dimensional stability, prepared by incorporating an inorganic filler, glass fibers and a modified polyolefin with a xylylenediamine type polyamide.
COPYRIGHT: (C)1978,JPO&Japio
JP3599577A 1977-03-30 1977-03-30 Polyamide resin composition Expired JPS6057464B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3599577A JPS6057464B2 (en) 1977-03-30 1977-03-30 Polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3599577A JPS6057464B2 (en) 1977-03-30 1977-03-30 Polyamide resin composition

Publications (2)

Publication Number Publication Date
JPS53120761A true JPS53120761A (en) 1978-10-21
JPS6057464B2 JPS6057464B2 (en) 1985-12-14

Family

ID=12457391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3599577A Expired JPS6057464B2 (en) 1977-03-30 1977-03-30 Polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS6057464B2 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167740A (en) * 1980-05-29 1981-12-23 Toyobo Co Ltd Polyblend composition
JPS57172953A (en) * 1981-04-17 1982-10-25 Toyobo Co Ltd Fiber-reinforced polymer blend composition
US4404312A (en) * 1981-04-17 1983-09-13 Toyo Boseki Kabushiki Kaisha Fiber-reinforced polymer blend composition
JPS6026057A (en) * 1983-07-20 1985-02-08 Kanebo Ltd Electrically conductive polyamide resin composition for molding
JPS6053550A (en) * 1983-09-05 1985-03-27 Mitsui Petrochem Ind Ltd Polypropylene composition compounded with inorganic filler
JPS6160754A (en) * 1984-09-03 1986-03-28 Asahi Chem Ind Co Ltd Glass fiber-reinforced polyamide resin composition
US4613647A (en) * 1984-03-28 1986-09-23 Chisso Corporation Polypropylene compositions containing polyamides reinforced by glass fibers
US4980407A (en) * 1988-10-21 1990-12-25 Toyoda Gosei Co., Ltd. Polyamide resin composition
US5248738A (en) * 1989-10-20 1993-09-28 Toyoda Gosei Co., Ltd. Vibration-damping resin molded products formed of a mixture of nylon 6 resin, a xylene diamine based nylon resin, and a nylon 66 resin
EP0717423A1 (en) * 1994-12-16 1996-06-19 Mitsubishi Denki Kabushiki Kaisha Insulating structure of switch
JP2002226705A (en) * 2001-01-31 2002-08-14 Mitsubishi Engineering Plastics Corp Polyamide resin composition and molded article
JP2010512422A (en) * 2006-06-15 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Nanocomposite composition of polyamide and sepiolite-type clay
JP2011052230A (en) * 2010-12-13 2011-03-17 Mitsubishi Engineering Plastics Corp Polyamide resin composition and molding

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167740A (en) * 1980-05-29 1981-12-23 Toyobo Co Ltd Polyblend composition
JPS6342662B2 (en) * 1980-05-29 1988-08-24 Toyo Boseki
JPS57172953A (en) * 1981-04-17 1982-10-25 Toyobo Co Ltd Fiber-reinforced polymer blend composition
US4404312A (en) * 1981-04-17 1983-09-13 Toyo Boseki Kabushiki Kaisha Fiber-reinforced polymer blend composition
JPH0128781B2 (en) * 1981-04-17 1989-06-05 Toyo Boseki
JPS6236069B2 (en) * 1983-07-20 1987-08-05 Kanebo Ltd
JPS6026057A (en) * 1983-07-20 1985-02-08 Kanebo Ltd Electrically conductive polyamide resin composition for molding
JPS6053550A (en) * 1983-09-05 1985-03-27 Mitsui Petrochem Ind Ltd Polypropylene composition compounded with inorganic filler
US4613647A (en) * 1984-03-28 1986-09-23 Chisso Corporation Polypropylene compositions containing polyamides reinforced by glass fibers
JPS6160754A (en) * 1984-09-03 1986-03-28 Asahi Chem Ind Co Ltd Glass fiber-reinforced polyamide resin composition
JPH032392B2 (en) * 1984-09-03 1991-01-14 Asahi Chemical Ind
US4980407A (en) * 1988-10-21 1990-12-25 Toyoda Gosei Co., Ltd. Polyamide resin composition
US5248738A (en) * 1989-10-20 1993-09-28 Toyoda Gosei Co., Ltd. Vibration-damping resin molded products formed of a mixture of nylon 6 resin, a xylene diamine based nylon resin, and a nylon 66 resin
EP0717423A1 (en) * 1994-12-16 1996-06-19 Mitsubishi Denki Kabushiki Kaisha Insulating structure of switch
JP2002226705A (en) * 2001-01-31 2002-08-14 Mitsubishi Engineering Plastics Corp Polyamide resin composition and molded article
JP4736194B2 (en) * 2001-01-31 2011-07-27 三菱エンジニアリングプラスチックス株式会社 Polyamide resin composition and molded article
JP2010512422A (en) * 2006-06-15 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Nanocomposite composition of polyamide and sepiolite-type clay
JP2011052230A (en) * 2010-12-13 2011-03-17 Mitsubishi Engineering Plastics Corp Polyamide resin composition and molding

Also Published As

Publication number Publication date
JPS6057464B2 (en) 1985-12-14

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