JPS53105964A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS53105964A
JPS53105964A JP2060777A JP2060777A JPS53105964A JP S53105964 A JPS53105964 A JP S53105964A JP 2060777 A JP2060777 A JP 2060777A JP 2060777 A JP2060777 A JP 2060777A JP S53105964 A JPS53105964 A JP S53105964A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
laser beam
absorber layer
comparatively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2060777A
Other languages
Japanese (ja)
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP2060777A priority Critical patent/JPS53105964A/en
Publication of JPS53105964A publication Critical patent/JPS53105964A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To carry out scribing by provideng a laser beam absorber layer on a comparatively thick glass protective film and radiation a comparatively feeble laser beam over the absorber layer.
COPYRIGHT: (C)1978,JPO&Japio
JP2060777A 1977-02-26 1977-02-26 Manufacture of semiconductor device Pending JPS53105964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2060777A JPS53105964A (en) 1977-02-26 1977-02-26 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2060777A JPS53105964A (en) 1977-02-26 1977-02-26 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS53105964A true JPS53105964A (en) 1978-09-14

Family

ID=12031940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2060777A Pending JPS53105964A (en) 1977-02-26 1977-02-26 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53105964A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005252196A (en) * 2004-03-08 2005-09-15 Toshiba Corp Semiconductor device and its manufacturing method
JP2014511042A (en) * 2011-04-14 2014-05-01 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Manufacturing method of semiconductor body
JP2014187143A (en) * 2013-03-22 2014-10-02 Shindengen Electric Mfg Co Ltd Substrate for forming semiconductor device, method for manufacturing the same, mesa type semiconductor device and method for manufacturing the same
JP2018125448A (en) * 2017-02-02 2018-08-09 株式会社ディスコ Wafer processing method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005252196A (en) * 2004-03-08 2005-09-15 Toshiba Corp Semiconductor device and its manufacturing method
JP2014511042A (en) * 2011-04-14 2014-05-01 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Manufacturing method of semiconductor body
US9324615B2 (en) 2011-04-14 2016-04-26 Osram Opto Semiconductors Gmbh Method for producing a semiconductor body
US9768344B2 (en) 2011-04-14 2017-09-19 Osram Opto Semiconductors Gmbh Method of producing a semiconductor body
EP2697835B1 (en) * 2011-04-14 2019-09-04 OSRAM Opto Semiconductors GmbH Method for producing a semiconductor body
JP2014187143A (en) * 2013-03-22 2014-10-02 Shindengen Electric Mfg Co Ltd Substrate for forming semiconductor device, method for manufacturing the same, mesa type semiconductor device and method for manufacturing the same
JP2018125448A (en) * 2017-02-02 2018-08-09 株式会社ディスコ Wafer processing method

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