JPS53100931A - Plating pretreatment method for beryllium copper materials - Google Patents
Plating pretreatment method for beryllium copper materialsInfo
- Publication number
- JPS53100931A JPS53100931A JP1574377A JP1574377A JPS53100931A JP S53100931 A JPS53100931 A JP S53100931A JP 1574377 A JP1574377 A JP 1574377A JP 1574377 A JP1574377 A JP 1574377A JP S53100931 A JPS53100931 A JP S53100931A
- Authority
- JP
- Japan
- Prior art keywords
- beryllium copper
- pretreatment method
- copper materials
- plating pretreatment
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
PURPOSE:To improve the adherence of a plated film at the time of plating a beryllium copper alloy by treating the alloy with a pickling soln. comprising a mixed aq. soln. of hydrochloric and sulfuric acids in which copper ions have been allowed to coexist.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1574377A JPS53100931A (en) | 1977-02-16 | 1977-02-16 | Plating pretreatment method for beryllium copper materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1574377A JPS53100931A (en) | 1977-02-16 | 1977-02-16 | Plating pretreatment method for beryllium copper materials |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53100931A true JPS53100931A (en) | 1978-09-02 |
Family
ID=11897233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1574377A Pending JPS53100931A (en) | 1977-02-16 | 1977-02-16 | Plating pretreatment method for beryllium copper materials |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53100931A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0640430A2 (en) * | 1993-08-31 | 1995-03-01 | BRUSH WELLMAN Inc. | Process for cladding precious metals to precipitation hardenable materials |
-
1977
- 1977-02-16 JP JP1574377A patent/JPS53100931A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0640430A2 (en) * | 1993-08-31 | 1995-03-01 | BRUSH WELLMAN Inc. | Process for cladding precious metals to precipitation hardenable materials |
EP0640430A3 (en) * | 1993-08-31 | 1995-07-19 | Brush Wellman | Process for cladding precious metals to precipitation hardenable materials. |
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