JPS529638A - Tinnelectroplating solution - Google Patents

Tinnelectroplating solution

Info

Publication number
JPS529638A
JPS529638A JP8577275A JP8577275A JPS529638A JP S529638 A JPS529638 A JP S529638A JP 8577275 A JP8577275 A JP 8577275A JP 8577275 A JP8577275 A JP 8577275A JP S529638 A JPS529638 A JP S529638A
Authority
JP
Japan
Prior art keywords
tinnelectroplating
solution
tinnelectroplating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8577275A
Other languages
Japanese (ja)
Other versions
JPS54408B2 (en
Inventor
Kazuhito Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP8577275A priority Critical patent/JPS529638A/en
Priority to GB2723476A priority patent/GB1502057A/en
Publication of JPS529638A publication Critical patent/JPS529638A/en
Publication of JPS54408B2 publication Critical patent/JPS54408B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP8577275A 1975-07-15 1975-07-15 Tinnelectroplating solution Granted JPS529638A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP8577275A JPS529638A (en) 1975-07-15 1975-07-15 Tinnelectroplating solution
GB2723476A GB1502057A (en) 1975-07-15 1976-06-30 Tin electro-plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8577275A JPS529638A (en) 1975-07-15 1975-07-15 Tinnelectroplating solution

Publications (2)

Publication Number Publication Date
JPS529638A true JPS529638A (en) 1977-01-25
JPS54408B2 JPS54408B2 (en) 1979-01-10

Family

ID=13868154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8577275A Granted JPS529638A (en) 1975-07-15 1975-07-15 Tinnelectroplating solution

Country Status (2)

Country Link
JP (1) JPS529638A (en)
GB (1) GB1502057A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388634A (en) * 1977-01-14 1978-08-04 Sumitomo Electric Industries Solder plating liquid
JP2009035768A (en) * 2007-08-01 2009-02-19 Taiyo Kagaku Kogyo Kk Tin electroplating solution and method for electronic component and tin-electroplated electronic component
CN113652719A (en) * 2021-08-13 2021-11-16 广西隆林利通线缆科技有限公司 Electroplating solution for tinning copper wire and method for electroplating tin on copper wire

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0431314Y2 (en) * 1986-04-16 1992-07-28
JP4812365B2 (en) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Tin electroplating solution and tin electroplating method
CN101595248B (en) * 2006-12-29 2011-04-27 日进素材产业株式会社 Sn-B plating solution and plating method using it

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4916176A (en) * 1972-06-07 1974-02-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4916176A (en) * 1972-06-07 1974-02-13

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388634A (en) * 1977-01-14 1978-08-04 Sumitomo Electric Industries Solder plating liquid
JPS609115B2 (en) * 1977-01-14 1985-03-07 住友電気工業株式会社 Lead or soldering liquid
JP2009035768A (en) * 2007-08-01 2009-02-19 Taiyo Kagaku Kogyo Kk Tin electroplating solution and method for electronic component and tin-electroplated electronic component
CN113652719A (en) * 2021-08-13 2021-11-16 广西隆林利通线缆科技有限公司 Electroplating solution for tinning copper wire and method for electroplating tin on copper wire
CN113652719B (en) * 2021-08-13 2024-01-19 广西隆林利通线缆科技有限公司 Electroplating solution for copper wire tinning and copper wire tinning method

Also Published As

Publication number Publication date
JPS54408B2 (en) 1979-01-10
GB1502057A (en) 1978-02-22

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