JPS5271681A - Method of forming printed circuit unit - Google Patents

Method of forming printed circuit unit

Info

Publication number
JPS5271681A
JPS5271681A JP51125546A JP12554676A JPS5271681A JP S5271681 A JPS5271681 A JP S5271681A JP 51125546 A JP51125546 A JP 51125546A JP 12554676 A JP12554676 A JP 12554676A JP S5271681 A JPS5271681 A JP S5271681A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit unit
forming printed
forming
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51125546A
Other languages
Japanese (ja)
Other versions
JPS5731667B2 (en
Inventor
Chiyaaruzu Aasaa Bingam Kenesu
Boorudouin Korin
Jiyooji Arubaato Giringam Aran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of JPS5271681A publication Critical patent/JPS5271681A/en
Publication of JPS5731667B2 publication Critical patent/JPS5731667B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
JP51125546A 1975-10-22 1976-10-21 Method of forming printed circuit unit Granted JPS5271681A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB43289/75A GB1497312A (en) 1975-10-22 1975-10-22 Production of printed circuit arrangements

Publications (2)

Publication Number Publication Date
JPS5271681A true JPS5271681A (en) 1977-06-15
JPS5731667B2 JPS5731667B2 (en) 1982-07-06

Family

ID=10428105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51125546A Granted JPS5271681A (en) 1975-10-22 1976-10-21 Method of forming printed circuit unit

Country Status (5)

Country Link
JP (1) JPS5271681A (en)
AU (1) AU498261B2 (en)
DE (1) DE2645947C2 (en)
GB (1) GB1497312A (en)
ZA (1) ZA765930B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138993A (en) * 1983-12-05 1985-07-23 イー・アイ・デユポン・ド・ネモアース・アンド・コンパニー Method of forming conductive through hole
JPS60140792A (en) * 1983-12-05 1985-07-25 イー・アイ・デユポン・ド・ネモアース・アンド・コンパニー Method of forming conductive through hole

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472238A (en) * 1983-12-05 1984-09-18 E. I. Du Pont De Nemours And Company Process using plasma for forming conductive through-holes through a dielectric layer
DE202014006674U1 (en) * 2014-08-20 2015-11-23 Automotive Lighting Reutlingen Gmbh Printed circuit board for vehicle lighting devices
CN112235951B (en) * 2020-10-20 2021-09-21 盐城维信电子有限公司 Method for manufacturing circuit boards with different copper thicknesses

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3319317A (en) * 1963-12-23 1967-05-16 Ibm Method of making a multilayered laminated circuit board
US3268653A (en) * 1964-04-29 1966-08-23 Ibm Printed circuit board with solder resistant coating in the through-hole connectors
US3471631A (en) * 1968-04-03 1969-10-07 Us Air Force Fabrication of microminiature multilayer circuit boards
US3871930A (en) * 1973-12-19 1975-03-18 Texas Instruments Inc Method of etching films made of polyimide based polymers

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138993A (en) * 1983-12-05 1985-07-23 イー・アイ・デユポン・ド・ネモアース・アンド・コンパニー Method of forming conductive through hole
JPS60140792A (en) * 1983-12-05 1985-07-25 イー・アイ・デユポン・ド・ネモアース・アンド・コンパニー Method of forming conductive through hole
JPH0141274B2 (en) * 1983-12-05 1989-09-04 Ii Ai Deyuhon De Nimoasu Ando Co
JPH0141273B2 (en) * 1983-12-05 1989-09-04 Ii Ai Deyuhon De Nimoasu Ando Co

Also Published As

Publication number Publication date
JPS5731667B2 (en) 1982-07-06
GB1497312A (en) 1978-01-05
AU1862476A (en) 1978-04-20
AU498261B2 (en) 1979-02-22
DE2645947A1 (en) 1977-04-28
ZA765930B (en) 1977-09-28
DE2645947C2 (en) 1983-01-27

Similar Documents

Publication Publication Date Title
JPS5236758A (en) Method of producing printed circuit
JPS5271681A (en) Method of forming printed circuit unit
JPS5276679A (en) Method of producing multiilayer printed circuit board
JPS5243976A (en) Method of producing printed circuit board
JPS5236762A (en) Method of producing printed circuit board
JPS5249468A (en) Method of producing bothhside printed circuit board
JPS51121181A (en) Method of forming printed circuit
JPS52378A (en) Method of forming printed wiring
JPS5254966A (en) Method of producing multiilayer printed circuit board
JPS5362176A (en) Method of forming printed circuit
JPS5273380A (en) Method of producing printed circuit board
JPS5241868A (en) Method of producing multiilayer printed circuit board
JPS5279272A (en) Method of producing multiilayer printed circuit board
JPS5274869A (en) Method of producing printed circuit board
JPS5270376A (en) Method of producing printed circuit board
JPS5250572A (en) Method of producing bothhside printed circuit board
JPS5233071A (en) Method of producing printed circuit board
JPS5240777A (en) Method of producing printed circuit board
JPS5238170A (en) Method of producing multiilayer printed circuit board
JPS5239174A (en) Method of producing printed circuit board
JPS5259852A (en) Method of producing printed circuit board
JPS5270375A (en) Method of producing printed circuit board
JPS5249467A (en) Method of producing printed circuit board
JPS5229968A (en) Method of producing multiilayer printed circuit board
JPS5260964A (en) Method of producing printed circuit board