JPS5257730A - Light source for information reading element - Google Patents
Light source for information reading elementInfo
- Publication number
- JPS5257730A JPS5257730A JP13382375A JP13382375A JPS5257730A JP S5257730 A JPS5257730 A JP S5257730A JP 13382375 A JP13382375 A JP 13382375A JP 13382375 A JP13382375 A JP 13382375A JP S5257730 A JPS5257730 A JP S5257730A
- Authority
- JP
- Japan
- Prior art keywords
- light source
- information reading
- reading element
- luminescent
- luminescent diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
- Image Input (AREA)
Abstract
PURPOSE: The wire disconnection, incomplete contact, connection directional error, etc. of each luminescent diode which is the luminescent element composing the light source for information reading element can be easily inspected and discriminated, at the same effectively preventing the breakage of the luminescent diode.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13382375A JPS5257730A (en) | 1975-11-06 | 1975-11-06 | Light source for information reading element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13382375A JPS5257730A (en) | 1975-11-06 | 1975-11-06 | Light source for information reading element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5257730A true JPS5257730A (en) | 1977-05-12 |
Family
ID=15113862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13382375A Pending JPS5257730A (en) | 1975-11-06 | 1975-11-06 | Light source for information reading element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5257730A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0465464U (en) * | 1990-10-19 | 1992-06-08 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4829770B1 (en) * | 1970-02-09 | 1973-09-13 | ||
JPS4995570A (en) * | 1973-01-12 | 1974-09-10 | ||
JPS5011673A (en) * | 1973-06-01 | 1975-02-06 |
-
1975
- 1975-11-06 JP JP13382375A patent/JPS5257730A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4829770B1 (en) * | 1970-02-09 | 1973-09-13 | ||
JPS4995570A (en) * | 1973-01-12 | 1974-09-10 | ||
JPS5011673A (en) * | 1973-06-01 | 1975-02-06 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0465464U (en) * | 1990-10-19 | 1992-06-08 |
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