JPS5245368U - - Google Patents
Info
- Publication number
- JPS5245368U JPS5245368U JP13230575U JP13230575U JPS5245368U JP S5245368 U JPS5245368 U JP S5245368U JP 13230575 U JP13230575 U JP 13230575U JP 13230575 U JP13230575 U JP 13230575U JP S5245368 U JPS5245368 U JP S5245368U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13230575U JPS5521342Y2 (en) | 1975-09-27 | 1975-09-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13230575U JPS5521342Y2 (en) | 1975-09-27 | 1975-09-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5245368U true JPS5245368U (en) | 1977-03-31 |
JPS5521342Y2 JPS5521342Y2 (en) | 1980-05-22 |
Family
ID=28612417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13230575U Expired JPS5521342Y2 (en) | 1975-09-27 | 1975-09-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5521342Y2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5352915U (en) * | 1976-09-29 | 1978-05-06 | ||
JPS58101443A (en) * | 1981-12-11 | 1983-06-16 | Hitachi Ltd | Resin-sealed semiconductor device |
JP2012146919A (en) * | 2011-01-14 | 2012-08-02 | Toyota Motor Corp | Semiconductor module |
-
1975
- 1975-09-27 JP JP13230575U patent/JPS5521342Y2/ja not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5352915U (en) * | 1976-09-29 | 1978-05-06 | ||
JPS5842405Y2 (en) * | 1976-09-29 | 1983-09-26 | 昌己 笠置 | beltless slacks |
JPS58101443A (en) * | 1981-12-11 | 1983-06-16 | Hitachi Ltd | Resin-sealed semiconductor device |
JP2012146919A (en) * | 2011-01-14 | 2012-08-02 | Toyota Motor Corp | Semiconductor module |
US8742556B2 (en) | 2011-01-14 | 2014-06-03 | Toyota Jidosha Kabushiki Kaisha | Semiconductor module |
Also Published As
Publication number | Publication date |
---|---|
JPS5521342Y2 (en) | 1980-05-22 |